Revision as of 13:29, 13 November 2019

Automated Coat/Develop System (S-Cubed Flexi)

THIS TOOL IS ONLY FOR STAFF USE AT THIS TIME.

About

To Be Added

@@ Line 1: / Line 1: @@
 {{tool|{{PAGENAME}}
 |picture=TBD.jpg
-|type = Lithography
 |super= Tony Bosch
 |location=Bay 7
 |description = Automatic Coat/Bake/Develop
-|manufacturer = S-Cubed
+|manufacturer = [https://www.s-cubed.com S-Cubed]
+|model = Flexi (Custom)
-|materials =
+|type = Wet Processing
-|toolid=
+|recipe = Lithography
-}}
+|materials =
+|toolid=67
+}}
+ '''THIS TOOL IS ONLY FOR STAFF USE AT THIS TIME.'''
 =About=
@@ Line 15: / Line 19: @@
 =Detailed Specifications=
-* Wafer Size:
+*Wafer Size: 100mm (150mm possible but not set up)
+*PR Coating Properties:
-* Photoresists/Underlayers Available:
+**Uniformity < 1.0%
-* Solvents Available:
+**< 100 particles on 100mm wafer
-* Developers Available:
+*Photoresists/Underlayers Available:
+**UV6-0.8
+**DS-K101-304
+**PMMA
+**PMGI SF11
+**PMGI SF5
+*Solvents Available:
+**EBR100
+*Developers Available:
+**AZ 300 MiF
 =Process Information=
+*Recipe Page for S-Cubed Coater: [[Lithography Recipes#Automated%20Coat.2FDevelop%20System%20Recipes%20.28S-Cubed%20Flexi.29|Lithography Recipes > Automated Coat/Develop System Recipes (S-Cubed Flexi]])
-* TBD
+*See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Photolith. Chemicals page] for info on the installed resists.
 =Operating Procedures=
+*''To Be Added''
-* TBD