Difference between revisions of "YES-150C-Various-Resists"

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(link to PR datasheets)
(Text replacement - "www.nanotech.ucsb.edu/wiki/" to "wiki.nanotech.ucsb.edu/wiki/")
 
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Once pressure flattens etching is complete.
 
Once pressure flattens etching is complete.
   
There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#PositivePR datasheets]) you can estimate etch rate from these plots.
+
There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#PositivePR datasheets]) you can estimate etch rate from these plots.
   
 
[[File:YES150CResists.jpg|660x660px]]
 
[[File:YES150CResists.jpg|660x660px]]

Latest revision as of 18:27, 6 April 2020

Pressure drop indicates completion of etch.

Once pressure flattens etching is complete.

There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the datasheets) you can estimate etch rate from these plots.

YES150CResists.jpg