Wet Etching Recipes

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Revision as of 10:25, 6 November 2013 by Bovington j (talk | contribs) (Compound Semiconductor Etching)
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How to use the wet etch table:

When entering a new etch into the table make a row for every etchant used in the solution such that the information can be sorted by etchant. For example, the InP etch HCl:H3PO4(1:3) and H3PO4:HCl(3:1). Likewise, if etch is known to be selective to multiple materials the etch should have a row for each material. For example HCl:H3PO4(1:3) is selective to both InGaAs and InGaAsP.

This multiple entry method may seem laborious for the person entering a new etch, however the power of sorting by selective materials and chemicals in a table with all materials is great.

Example Wet Etching Table (Include All Materials)

Material Etchant Rate (nm/min) Anisotropy Selective to Selectivity Ref. Notes Confirmed by Extra column
InP HCl:H3PO4(1:3) ~1000 Highly InGaAs High [| Lamponi (p.102)] Example Jon Doe Example
InP HCl:H3PO4(1:3) ~1000 Highly InGaAsP High [| Lamponi (p.102)] Example Jon Doe Example
InP H3PO4:HCl(3:1) ~1000 Highly InGaAs High [| Lamponi (p.102)] Example Jon Doe Example
InP H3PO4:HCl(3:1) ~1000 Highly InGaAsP High [| Lamponi (p.102)] Example Jon Doe Example

Compound Semiconductor Etching

Metal Etching

Silicon etching

Dielectric etching

Organic removal

Gold Plating

Chemi-Mechanical Polishing (CMP)