Difference between revisions of "Wafer scanning process traveler"

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(→‎Surfscan additional information: surfscan additional info)
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Surfscan 6200 locates, sizes, and counts defects in semiconductor substrate material down to 0.157um at a 95% capture rate and down to 0.09um at an 80% capture rate. The instrument uses laser beam scanning for detecting defect contamination and displays scan results in color-coded wafer maps, histograms, and summaries. The instrument scans wafers contained in a cassette. Cassettes can be loaded onto the left indexer, right indexer, or both indexers. Cassette configuration can be ( R only, L only, Right to left, Left to right, Sort wafers). When manually aligning wafers, one of the flats of each wafer should face the front of the cassette. When using a mechanical aligner, the flats should face the rear of the cassette. If wafers get scratched, damaged or mishandled immediately perform cassette calibration. The instrument communicates with an operator using the Microsoft Windows. To use an application, choose menus or commands displayed in the menu bar, or use keypad commands. The system menu is an icon-based menu. Double click on the application icon to start an application. In the Scan window , the menu bar displays: ID, CASS, AUTO, HOME,  SAVE, and PRINT commands.   
 
Surfscan 6200 locates, sizes, and counts defects in semiconductor substrate material down to 0.157um at a 95% capture rate and down to 0.09um at an 80% capture rate. The instrument uses laser beam scanning for detecting defect contamination and displays scan results in color-coded wafer maps, histograms, and summaries. The instrument scans wafers contained in a cassette. Cassettes can be loaded onto the left indexer, right indexer, or both indexers. Cassette configuration can be ( R only, L only, Right to left, Left to right, Sort wafers). When manually aligning wafers, one of the flats of each wafer should face the front of the cassette. When using a mechanical aligner, the flats should face the rear of the cassette. If wafers get scratched, damaged or mishandled immediately perform cassette calibration. The instrument communicates with an operator using the Microsoft Windows. To use an application, choose menus or commands displayed in the menu bar, or use keypad commands. The system menu is an icon-based menu. Double click on the application icon to start an application. In the Scan window , the menu bar displays: ID, CASS, AUTO, HOME,  SAVE, and PRINT commands.   
 
+
# Log in, access code is BOSS.   
Log in, access code is BOSS.   
+
# Double click on the icon of the application to start application.   
 
+
# Log off the system, to exit the current application.   
Double click on the icon of the application to start application.   
+
#* The Tencor Instrument banner at the top of the screen contains a disk  status. If it is green the database space is available. If it is yellow, free disk or data space is getting low, so it needs to be increased free space. It is red, there is no free space.   
 
+
# Before scanning:   
Log off the system, to exit the current application.   
+
#* Choose the recipe to be used   
 
+
#* Load the cassette of substrates onto the right locator   
The Tencor Instrument banner at the top of the screen contains a disk  status. If it is green the database space is available. If it is yellow, free disk or data space is getting low, so it needs to be increased free space. It is red, there is no free space.   
+
#* Choose scan options   
 
+
#* Enter a Lot ID, if desired   
Before scanning:   
+
# Scanning methods:  
 
+
#* One substrate-direct access( cassette) or more( AUTO)   
1Choose the recipe to be used   
+
# Scanning options:   
 
+
#* automatic or manual operation   
2Load the cassette of substrates onto the right locator   
+
#* scan sequence   
 
+
#* microscope hold for MicroViewing   
3Choose scan options   
+
# The recipe sets:   
 
+
#* Primary data of interest ( defect or haze)   
4Enter a Lot ID, if desired   
+
#* Initial data displays (map or histogram or both)   
 
+
# Using the summary box:   
Scanning methods:  
+
#* LPD- the total of all light point defects and their total surface area   
 
+
#* Bins (1-8)- Bin splits intervals and the count of LPDs for each bin   
One substrate-direct access( cassette) or more( AUTO)   
+
#* Mean-the mean of collected LPDS   
 
+
#* Std Dev-the standard deviation of collected LPDs   
Scanning options:   
+
#* Area Count –The count of all areas( areas and scratches) on the substrate and the their total surface area   
 
+
#* Scratch Count-The total number of scratches and their total surface area   
1. automatic or manual operation   
+
#* Sum of all defects-The sum of all LPDs and areas, including scratches   
 
+
#* Haze Region-The percentage of the measurable surface area containing haze   
2. scan sequence   
+
#* Haze average   
 
+
#* Haze peak   
3. microscope hold for MicroViewing   
+
# To add the comment in the summary screen, press the minus key on the keypad or the minus button (Top left corner)   
 
+
# A LPD histogram plots the LPD count versus LPD diameter or cross-sections specified in the recipe. A haze histogram plots the number of defects versus haze values. Defect histograms display a red total area bar at the right.   
The recipe sets:   
+
# Using the histogram   
 
+
#* Zooming the histogram-allowing you to narrow the data range   
1 Primary data of interest ( defect or haze)   
+
#* Can be done using keypad or using the mouse (double click-left button and two markers will appear)   
 
+
# Using the wafer map-locating defects and dimensions f the LPD   
2 Initial data displays (map or histogram or both)   
+
#* You can magnify (zoom) the wafer map, apply user defined coordinates to the map(X-Y coordinate option required), and MicroView an area of the wafer.   
 
+
#* To magnify( zoom) a map- double click the left button in the map   
Using the summary box:   
+
# Examining a microview   
 
+
#* Allows to examine a three dimensional representation of the surface of the substrate
LPD- the total of all light point defects and their total surface area   
+
#* To display a MicroView- press microscope, scan the substrate, double click the left mouse in the map, press zoom. The instrument displays the panning window and magnifies the map. Move the panning cursor to the area of interest, then press microscope.  
 
+
#* To view the Micro View in full-screen, press ZOOM  
Bins (1-8)- Bin splits intervals and the count of LPDs for each bin   
+
# Recipes:   
 
+
#* A recipe name can be up to 19 characters long, and can contain any combination of alphabetic, numeric, or special characters.   
Mean-the mean of collected LPDS   
+
#* Load- open and load a selected recipe   
 
+
#* View/Modify – to view or change the recipe   
Std Dev-the standard deviation of collected LPDs   
+
#* New- create a new recipe   
 
+
#* Save- save the recipe using the current recipe name   
Area Count –The count of all areas( areas and scratches) on the substrate and the their total surface area   
+
#* Save as- save the current recipe using a new name   
 
+
#* Delete- delete the recipe   
Scratch Count-The total number of scratches and their total surface area   
+
#* Recipe can be created, modified or viewed by opening the Recipe dialog box  from the Scan or Setup applications  
 
+
# Recipe parameters:  
Sum of all defects-The sum of all LPDs and areas, including scratches   
+
#* substrate diameter  
 
+
#* Edge exclusion-excluded from scan results, min=1mm. max=1/2 of wafer diameter  
Haze Region-The percentage of the measurable surface area containing haze   
+
#* Gain/Max size- gain determines the range of data collected during a scan  
 
+
#* For Surfscan 6200 gain is value from 1-8.  
Haze average   
+
#** For value=1, size=63um or 250um2 ( GAIN 1).
 
+
#** For value=8, size=0.12um or 0.005um2 (GAIN8).  
Haze peak   
+
#* When you change Gain, the instrument automatically sets Area Form to Max Size.  
 
+
#* Threshold specifies the smallest LPD size to be included in the scan results  
To add the comment in the summary screen, press the minus key on the keypad or the minus button ( Top left corner)   
+
#* Throughput is the speed at which the wafer is processed through the instrument: High, medium, normal, low.  
 
+
#* Area From - this value determines the LPD size above which the instrument classifies LPD as areas  
A LPD histogram plots the LPD count versus LPD diameter or cross-sections specified in the recipe. A haze histogram plots the number of defects versus haze values. Defect histograms display a red total area bar at the right.   
+
#* LPD count- the max number of light particle defects allowed( 0-99999)  
 
+
#* LPD/cm2- Number of LPDs allowed per square centimeter
1.Using the histogram   
+
#* Area count-total number of areas allowed ( areas+ scratches)  
 
+
#* Area mm2- total of all areas allowed in mm2  
Zooming the histogram-allowing you to narrow the data range   
+
#* Scratch count-number of scratches allowed in mm
 
+
#* Selecting substrate parameters:  
Can be done using keypad or using the mouse (double click-left button and two markers will appear)   
+
#** Edge exclusion=4mm (choose the select button at the bottom left of the recipe dialog box-to select a new substrate and thickness)
 
+
#** T (Tencor Instruments supplied calibration curve is used)  
2. Using the wafer map-locating defects and dimensions f the LPD   
+
#** C (Customer supplied calibration curve is used)  
 
+
# The instrument collects defects and haze data from a wafer by illuminating the wafer surface with a laser beam, collecting the scattered light through an optics system, and amplifying the scattered light with a photomultiplier tube(PMT). The gain of the PMT determines the dynamic range for collecting data.
You can magnify( zoom) the wafer map, apply user defined coordinates to the map(X-Y coordinate option required), and MicroView an area of the wafer.   
+
# Selecting an LPD range  
 
+
#* To specify the LPD range, use Gain, Threshold, and Area From parameters.
To magnify( zoom) a map- double click the left button in the map   
+
#* The gain setting determines the maximum LPD size of interest.
 
+
#* The threshold determines the smallest LPD collected during a scan. Using a combination of gain and the threshold settings, you can scan for a broad or narrow band of LPDs.
3. Examining a microview   
 
 
 
Allows to examine a three dimensional representation of the surface of the substrate  
 
To display a MicroView- press microscope, scan the substrate, double click the left mouse in the map, press zoom. The instrument displays the panning window and magnifies the map. Move the panning cursor to the area of interest, then press microscope.  
 
 
 
To view the Micro View in full-screen, press ZOOM  
 
 
 
RECIPES:   
 
 
 
A recipe name can be up to 19 characters long, and can contain any combination of alphabetic, numeric, or special characters.   
 
 
 
Load- open and load a selected recipe   
 
 
 
View/Modify – to view or change the recipe   
 
 
 
New- create a new recipe   
 
 
 
Save- save the recipe using the current recipe name   
 
 
 
Save as- save the current recipe using a new name   
 
 
 
Delete- delete the recipe   
 
 
 
Recipe can be created, modified or viewed by opening the Recipe dialog box  from the Scan or Setup applications  
 
 
Recipe parameters:  
 
 
 
1.data collection parameters
 
 
 
substrate diameter~125mm
 
 
 
Edge exclusion~ excluded from scan results, min=1mm. max=1/2 of wafer diameter  
 
 
 
Gain/Max size- gain determines the range of data collected during a scan.
 
 
 
For Surfscan 6200 gain is value from 1-8.  
 
 
 
For value=1, size=63um or 250um2
 
 
 
For value=8, size=0.12um or 0.005um2.  
 
 
 
When you change Gain, the instrument automatically sets Area Form to Max Size.  
 
 
 
Threshold specifies the smallest LPD size to be included in the scan results  
 
 
 
Throughput- the speed at which the wafer is processed through the instrument: High, medium, normal, low.  
 
 
 
Area From-this value determines the LPD size above which the instrument classifies LPD as areas  
 
 
 
LPD count- the max number of light particle defects allowed( 0-99999)  
 
 
 
LPD/cm2- Number of LPDs allowed per square centimeter (wafer #3: 417/((4.6*4.6)*3.14)=417/66.44=6.27cm2
 
 
 
Area count-total number of areas allowed ( areas+ scratches)  
 
 
 
Area mm2- total of all areas allowed in mm2  
 
 
 
Scratch count-number of scratches allowed in mmm
 
 
 
Scratch mm-Selecting substrate parameters:  
 
 
 
Edge exclusion=4mmm
 
 
 
Choose the select button at the bottom left of the recipe dialog box-to select a new substrate and thickness  
 
 
 
T (Tencor Instruments supplied calibration curve is used)
 
 
 
C (Customer supplied calibration curve is used)  
 
 
 
The instrument collects defects and haze data from a wafer by illuminating the wafer surface with a laser beam, collecting the scattered light through an optics system, and amplifying the scattered light with a photomultiplier tube(PMT). The gain of the PMT determines the dynamic range for collecting data.  
 
 
 
Selecting an LPD range  
 
 
 
To specify the LPD range, use Gain, Threshold, and Area From parameters. The gain setting determines the maximum LPD size of interest, the threshold determines the smallest LPD collected during a scan. Using a combination of gain and the threshold settings, you can scan for a broad or narrow band of LPDs.
 

Revision as of 17:16, 31 March 2020

The wafers used for process calibration are ordered from SVM. These are 4 inch silicon wafers with low particle count (LPD= light particle detection<100). The box with 25 wafers is stored in the cleanroom and used only for process calibration. Wafers are handled very carefully, because with every loading and unloading some particles will be added.

Scanning procedure

before process calibration

  1. Log in (access code is boss)
  2. Load desired number of Si wafers to the carrier that says " SURFSCAN" .
  3. Place the carrier with wafers to the right indexer.
  4. Select in the menu option "CAS" (this will read all wafers that are in the carrier)
  5. Load one of standard recipes
  6. Select one of the recipes:
    • UCSB Gain4 ( measuring small particles 0.16-2.8um)
    • UCSB Gain2 ( measuring larger particles 2.8-28um)
  7. Select one of the recipe, modify it if needed, default the bin
  8. Select the wafer you want to scan
  9. Press SCAN
  10. Wait until scan is finished
  11. Record: LPD, particles #1, particles #8, haze
  12. Take a picture of the scan (by phone)
  13. Select "Home" so indexer moves up to loading/unloading positon
  14. Wafers are ready for process calibration

after process calibration

  1. Log in (access code is boss)
  2. Load treated Si wafers to the carrier that says " SURFSCAN" .
  3. Place the carrier with wafers to the right indexer.
  4. Select in the menu option "CAS" (this will read all wafers that are in the carrier)
  5. Load one of standard recipes
  6. Select one of the recipes :
    • UCSB Gain4 ( measuring small particles 0.16-2.8um)
    • UCSB Gain2 ( measuring larger particles 2.8-28um)
  7. Select one of the recipe, modify it if needed, default the bin
  8. Select the wafer you want to scan
  9. Press SCAN
  10. Wait until scan is finished
  11. Record: LPD, particles #1, particles #8, haze
  12. Take a picture of the scan (by phone)
  13. Select "Home" so indexer moves up to loading/unloading positon
  14. Unload the wafers

Plotting data

Make an excel sheet.

Enter info for Gain4 (particles#1, particles#8, LPD, haze) before and after process calibration.

Enter info for Gain2 (particles#1, particles#8, LPD, haze) before and after process calibration.

For each gain figure out delta ( LPD after- LPD before).

Make a plot delta vs. time).

Surfscan additional information

Surfscan 6200 locates, sizes, and counts defects in semiconductor substrate material down to 0.157um at a 95% capture rate and down to 0.09um at an 80% capture rate. The instrument uses laser beam scanning for detecting defect contamination and displays scan results in color-coded wafer maps, histograms, and summaries. The instrument scans wafers contained in a cassette. Cassettes can be loaded onto the left indexer, right indexer, or both indexers. Cassette configuration can be ( R only, L only, Right to left, Left to right, Sort wafers). When manually aligning wafers, one of the flats of each wafer should face the front of the cassette. When using a mechanical aligner, the flats should face the rear of the cassette. If wafers get scratched, damaged or mishandled immediately perform cassette calibration. The instrument communicates with an operator using the Microsoft Windows. To use an application, choose menus or commands displayed in the menu bar, or use keypad commands. The system menu is an icon-based menu. Double click on the application icon to start an application. In the Scan window , the menu bar displays: ID, CASS, AUTO, HOME, SAVE, and PRINT commands.

  1. Log in, access code is BOSS.
  2. Double click on the icon of the application to start application.
  3. Log off the system, to exit the current application.
    • The Tencor Instrument banner at the top of the screen contains a disk status. If it is green the database space is available. If it is yellow, free disk or data space is getting low, so it needs to be increased free space. It is red, there is no free space.
  4. Before scanning:
    • Choose the recipe to be used
    • Load the cassette of substrates onto the right locator
    • Choose scan options
    • Enter a Lot ID, if desired
  5. Scanning methods:
    • One substrate-direct access( cassette) or more( AUTO)
  6. Scanning options:
    • automatic or manual operation
    • scan sequence
    • microscope hold for MicroViewing
  7. The recipe sets:
    • Primary data of interest ( defect or haze)
    • Initial data displays (map or histogram or both)
  8. Using the summary box:
    • LPD- the total of all light point defects and their total surface area
    • Bins (1-8)- Bin splits intervals and the count of LPDs for each bin
    • Mean-the mean of collected LPDS
    • Std Dev-the standard deviation of collected LPDs
    • Area Count –The count of all areas( areas and scratches) on the substrate and the their total surface area
    • Scratch Count-The total number of scratches and their total surface area
    • Sum of all defects-The sum of all LPDs and areas, including scratches
    • Haze Region-The percentage of the measurable surface area containing haze
    • Haze average
    • Haze peak
  9. To add the comment in the summary screen, press the minus key on the keypad or the minus button (Top left corner)
  10. A LPD histogram plots the LPD count versus LPD diameter or cross-sections specified in the recipe. A haze histogram plots the number of defects versus haze values. Defect histograms display a red total area bar at the right.
  11. Using the histogram
    • Zooming the histogram-allowing you to narrow the data range
    • Can be done using keypad or using the mouse (double click-left button and two markers will appear)
  12. Using the wafer map-locating defects and dimensions f the LPD
    • You can magnify (zoom) the wafer map, apply user defined coordinates to the map(X-Y coordinate option required), and MicroView an area of the wafer.
    • To magnify( zoom) a map- double click the left button in the map
  13. Examining a microview
    • Allows to examine a three dimensional representation of the surface of the substrate
    • To display a MicroView- press microscope, scan the substrate, double click the left mouse in the map, press zoom. The instrument displays the panning window and magnifies the map. Move the panning cursor to the area of interest, then press microscope.
    • To view the Micro View in full-screen, press ZOOM
  14. Recipes:
    • A recipe name can be up to 19 characters long, and can contain any combination of alphabetic, numeric, or special characters.
    • Load- open and load a selected recipe
    • View/Modify – to view or change the recipe
    • New- create a new recipe
    • Save- save the recipe using the current recipe name
    • Save as- save the current recipe using a new name
    • Delete- delete the recipe
    • Recipe can be created, modified or viewed by opening the Recipe dialog box from the Scan or Setup applications
  15. Recipe parameters:
    • substrate diameter
    • Edge exclusion-excluded from scan results, min=1mm. max=1/2 of wafer diameter
    • Gain/Max size- gain determines the range of data collected during a scan
    • For Surfscan 6200 gain is value from 1-8.
      • For value=1, size=63um or 250um2 ( GAIN 1).
      • For value=8, size=0.12um or 0.005um2 (GAIN8).
    • When you change Gain, the instrument automatically sets Area Form to Max Size.
    • Threshold specifies the smallest LPD size to be included in the scan results
    • Throughput is the speed at which the wafer is processed through the instrument: High, medium, normal, low.
    • Area From - this value determines the LPD size above which the instrument classifies LPD as areas
    • LPD count- the max number of light particle defects allowed( 0-99999)
    • LPD/cm2- Number of LPDs allowed per square centimeter
    • Area count-total number of areas allowed ( areas+ scratches)
    • Area mm2- total of all areas allowed in mm2
    • Scratch count-number of scratches allowed in mm
    • Selecting substrate parameters:
      • Edge exclusion=4mm (choose the select button at the bottom left of the recipe dialog box-to select a new substrate and thickness)
      • T (Tencor Instruments supplied calibration curve is used)
      • C (Customer supplied calibration curve is used)
  16. The instrument collects defects and haze data from a wafer by illuminating the wafer surface with a laser beam, collecting the scattered light through an optics system, and amplifying the scattered light with a photomultiplier tube(PMT). The gain of the PMT determines the dynamic range for collecting data.
  17. Selecting an LPD range
    • To specify the LPD range, use Gain, Threshold, and Area From parameters.
    • The gain setting determines the maximum LPD size of interest.
    • The threshold determines the smallest LPD collected during a scan. Using a combination of gain and the threshold settings, you can scan for a broad or narrow band of LPDs.