Difference between revisions of "Wafer Coating Process Traveler"
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#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
||
#*Pump down. |
#*Pump down. |
||
| − | #*Load the deposition recipe (STD SiO2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/ |
+ | #*Load the deposition recipe (STD SiO2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data]. |
#*Unload the wafer. |
#*Unload the wafer. |
||
#Cleaning |
#Cleaning |
||
| Line 25: | Line 25: | ||
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
||
#*Pump down. |
#*Pump down. |
||
| − | #*Load the deposition recipe (STD Nitride2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/ |
+ | #*Load the deposition recipe (STD Nitride2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data]. |
#*Unload the wafer. |
#*Unload the wafer. |
||
#Cleaning |
#Cleaning |
||
| Line 41: | Line 41: | ||
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
||
#*Pump down. |
#*Pump down. |
||
| − | #*Load the deposition recipe (STD LS Nitride2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/ |
+ | #*Load the deposition recipe (STD LS Nitride2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data]. |
#*Unload the wafer. |
#*Unload the wafer. |
||
#Cleaning |
#Cleaning |
||
Revision as of 16:52, 22 April 2020
There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)
Standard Oxide Deposition
STD SiO2
- Log in to Advanced PECVD #2
- Seasoning
- Load the seasoning recipe (STD SiO2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
- Deposition
- Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
- Pump down.
- Load the deposition recipe (STD SiO2), and run it. Deposition time is variable. Get the rate from historical data.
- Unload the wafer.
- Cleaning
- Wipe sidewall first with DI water, followed by IPA.
- Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
- Log out
Standard Nitride Deposition
STD Nitride2
- Log in to Advanced PECVD #2
- Seasoning
- Load the seasoning recipe (STD Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
- Deposition
- Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
- Pump down.
- Load the deposition recipe (STD Nitride2), and run it. Deposition time is variable. Get the rate from historical data.
- Unload the wafer.
- Cleaning
- Wipe sidewall first with DI water, followed by IPA.
- Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
- Log out
Standard Low Stress Deposition
STD LS Nitride2
- Log in to Advanced PECVD #2
- Seasoning
- Load the seasoning recipe (STD LS Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
- Deposition
- Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
- Pump down.
- Load the deposition recipe (STD LS Nitride2), and run it. Deposition time is variable. Get the rate from historical data.
- Unload the wafer.
- Cleaning
- Wipe sidewall first with DI water, followed by IPA.
- Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
- Log out