Difference between revisions of "Wafer Coating Process Traveler"
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==== Standard oxide deposition ==== |
==== Standard oxide deposition ==== |
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| + | #Log in to Advanced PECVD #2 |
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| − | |||
| + | #Seasoning |
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| + | #*Load the seasoning recipe (STD SiO2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition. |
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| + | #Deposition |
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| + | #*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
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| + | #*Pump down. |
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| + | #*Load the deposition recipe (SiN@250C), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/Vacuum_Deposition_Recipes historical data]. |
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| + | #*Unload the wafer. |
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| + | #Cleaning |
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| + | #*Wipe sidewall first with DI water, followed by IPA. |
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| + | #*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning. |
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| + | #*Log out |
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=== STD Nitride2 === |
=== STD Nitride2 === |
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Revision as of 16:47, 22 April 2020
There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)
STD SiO2
Standard oxide deposition
- Log in to Advanced PECVD #2
- Seasoning
- Load the seasoning recipe (STD SiO2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
- Deposition
- Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
- Pump down.
- Load the deposition recipe (SiN@250C), and run it. Deposition time is variable. Get the rate from historical data.
- Unload the wafer.
- Cleaning
- Wipe sidewall first with DI water, followed by IPA.
- Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
- Log out