Difference between revisions of "Wafer Coating Process Traveler"

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=== Unaxis deposition - SiO2 LDR film @250°C ===
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There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)
'''SiO2 LDR - Oxide Low Deposition Rate'''
 
  
a) Prepare three 4” wafers:
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=== STD SiO2 ===
* for seasoning (regular Si wafer ~500nm thick)
 
* for deposition (your wafer for deposition)
 
* for cleaning ( Si thick wafer~0.8-1um)
 
b) Load all wafers in a cassette, making sure major flat is facing outside (toward you). Try to align flats for all three wafers.
 
  
c) Edit standard recipes (for seasoning, deposition, and cleaning). You can ONLY change the time in recipes.
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==== Standard oxide deposition ====
* Seasoning recipe name: SiO2 seasoning, t=2min
 
* Deposition recipe name: SiO2 LDR 250°C, t=VARIABLE sec
 
** Get rates from [[PECVD Recipes#Thin-Film Properties 6|historical data]].
 
* Cleaning recipe name: Post dep PD, t=VARIABLE sec
 
** Get rates for [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29 Cleaning Recipes Unaxis VLR]  .
 
There is only one SiO2 seasoning recipe. This same recipe is used for seasoning for both LDR and HDR depositions. The goal in this step is to prepare the chamber and deposit ~200nm of SiO2 on walls.
 
  
d) Run the job (name the job/select the wafer, execute the job)
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=== STD Nitride2 ===
  
e) Unload wafers ONLY when all runs are finished.
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==== Standard nitride deposition ====
  
=== Unaxis deposition - 300nm SiO2 HDR film @250°C ===
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=== STD LS Nitride2 at 300C ===
'''SiO2 HDR - Oxide High Deposition Rate'''
 
  
a) Prepare three 4” wafers:
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==== Standard low stress nitride deposition ====
* for seasoning (regular Si wafer ~500nm thick)
 
* for deposition (your wafer for deposition)
 
* for cleaning ( Si thick wafer~0.8-1um )
 
b) Load all wafers in a cassette, making sure major flat is facing outside (toward you). Try to align flats for all three wafers.
 
 
 
c) Edit standard recipes (for seasoning, deposition, and cleaning). You can ONLY change the time in recipes.
 
* Seasoning recipe name: SiO2 seasoning, t=2min
 
* Deposition recipe name: SiO2 HDR 250°C, t=VARIABLE sec
 
** Get rates from [[PECVD Recipes#Thin-Film Properties 6|historical data]].
 
* Cleaning recipe name: Post dep PD, t=VARIABLE sec
 
** Get rates for [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29 Cleaning Recipes Unaxis VLR] 
 
There is only one SiO2 seasoning recipe. This same recipe is used for seasoning for both LDR and HDR depositions. The goal in this step is to prepare the chamber and deposit ~200nm of SiO2 on walls.
 
 
 
d) Run the job (name the job/select the wafer, execute the job)
 
 
 
e) Unload wafers ONLY when all runs are finished.
 
 
 
=== Unaxis deposition - 300nm SiN film @250°C ===
 
'''SiN - Silicon Nitride'''
 
 
 
a) Prepare three 4” wafers:
 
* for seasoning (regular Si wafer ~500nm thick)
 
* for deposition (your wafer for deposition)
 
* for cleaning ( Si thick wafer~0.8-1um)
 
b) Load all wafers in a cassette, making sure major flat is facing outside (toward you). Try to align flats for all three wafers.
 
 
 
c) Edit standard recipes (for seasoning, deposition, and cleaning). You can ONLY change the time in recipes.
 
* Seasoning recipe name: SiN seasoning, t=5min
 
* Deposition recipe name: SiN 250°C, t=VARIABLE sec
 
** Get rates from [[PECVD Recipes#Thin-Film Properties 6|historical data]].
 
* Cleaning recipe name: Post dep PD, t=VARIABLE sec
 
** Get rates for [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29 Cleaning Recipes Unaxis VLR]
 
d) Run the job (name the job/select the wafer, execute the job)
 
 
 
e) Unload wafers ONLY when all runs are finished.
 
 
 
=== Unaxis deposition - 300nm SiN LS film @250°C ===
 
'''SiN LS - Silicon Nitride Low Stress'''
 
 
 
a) Prepare three 4”wafers:
 
* for seasoning (regular Si wafer ~500nm thick)
 
* for deposition (your wafer for deposition)
 
* for cleaning ( Si thick wafer~0.8-1um )
 
b) Load all wafers in a cassette, making sure major flat is facing outside (toward you). Try to align flats for all three wafers.
 
 
 
c) Edit standard recipes (for seasoning, deposition, and cleaning). You can ONLY change the time in recipes.
 
* Seasoning recipe name: SiN seasoning, t=2min
 
* Deposition recipe name: SiN LS 250°C, t=VARIABLE sec
 
** Get rates from [[PECVD Recipes#Thin-Film Properties 6|historical data]].
 
* Cleaning recipe name: Post dep PD, t=VARIABLE sec
 
** Get rates for [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#ICP-PECVD_.28Unaxis_VLR.29 Cleaning Recipes Unaxis VLR]
 
d) Run the job (name the job/select the wafer, execute the job)
 
 
 
e) Unload wafers ONLY when all runs are finished.
 

Revision as of 15:42, 22 April 2020

There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)

STD SiO2

Standard oxide deposition

STD Nitride2

Standard nitride deposition

STD LS Nitride2 at 300C

Standard low stress nitride deposition