Difference between revisions of "Wafer Coating Process Traveler"

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There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)
  
There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)
   
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=== STD SiO2 ===
 +
=== Standard Oxide Deposition ===
   
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==== Standard oxide deposition ====
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==== STD SiO2 ====
  +
#Log in to Advanced PECVD #2
  +
#Seasoning
  +
#*Load the seasoning recipe (STD SiO2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
  +
#Deposition
  +
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
  +
#*Pump down.
  +
#*Load the deposition recipe (STD SiO2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data].
  +
#*Unload the wafer.
  +
#Cleaning
  +
#*Wipe sidewall first with DI water, followed by IPA.
  +
#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
  +
#*Log out
  +
=== Standard Nitride Deposition ===
   
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=== STD Nitride2 ===
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==== STD Nitride2 ====
  +
#Log in to Advanced PECVD #2
  +
#Seasoning
  +
#*Load the seasoning recipe (STD Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
  +
#Deposition
  +
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
  +
#*Pump down.
  +
#*Load the deposition recipe (STD Nitride2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data].
  +
#*Unload the wafer.
  +
#Cleaning
  +
#*Wipe sidewall first with DI water, followed by IPA.
  +
#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
  +
#*Log out
   
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==== Standard nitride deposition ====
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=== Standard Low Stress Deposition ===
   
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=== STD LS Nitride2 at 300C ===
 +
==== STD LS Nitride2 ====
  +
#Log in to Advanced PECVD #2
  +
#Seasoning
  +
#*Load the seasoning recipe (STD LS Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
  +
#Deposition
  +
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
  +
#*Pump down.
  +
#*Load the deposition recipe (STD LS Nitride2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data].
  +
#*Unload the wafer.
  +
#Cleaning
  +
#*Wipe sidewall first with DI water, followed by IPA.
  +
#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
  +
#*Log out
   
  +
#
−
==== Standard low stress nitride deposition ====
  

Latest revision as of 16:54, 22 April 2020

There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)

Standard Oxide Deposition

STD SiO2

  1. Log in to Advanced PECVD #2
  2. Seasoning
    • Load the seasoning recipe (STD SiO2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
  3. Deposition
    • Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
    • Pump down.
    • Load the deposition recipe (STD SiO2), and run it. Deposition time is variable. Get the rate from historical data.
    • Unload the wafer.
  4. Cleaning
    • Wipe sidewall first with DI water, followed by IPA.
    • Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
    • Log out

Standard Nitride Deposition

STD Nitride2

  1. Log in to Advanced PECVD #2
  2. Seasoning
    • Load the seasoning recipe (STD Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
  3. Deposition
    • Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
    • Pump down.
    • Load the deposition recipe (STD Nitride2), and run it. Deposition time is variable. Get the rate from historical data.
    • Unload the wafer.
  4. Cleaning
    • Wipe sidewall first with DI water, followed by IPA.
    • Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
    • Log out

Standard Low Stress Deposition

STD LS Nitride2

  1. Log in to Advanced PECVD #2
  2. Seasoning
    • Load the seasoning recipe (STD LS Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
  3. Deposition
    • Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
    • Pump down.
    • Load the deposition recipe (STD LS Nitride2), and run it. Deposition time is variable. Get the rate from historical data.
    • Unload the wafer.
  4. Cleaning
    • Wipe sidewall first with DI water, followed by IPA.
    • Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
    • Log out
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