Difference between revisions of "Wafer Cleaver (PELCO Flip-Scribe)"
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|type = Packaging |
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|super= Brian Thibeault |
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|description = Manual Cleaving |
|description = Manual Cleaving |
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|model = [https://www.tedpella.com/Material-Sciences_html/PELCO-FlipScribe.aspx PELCO Flip-Scribe] |
|model = [https://www.tedpella.com/Material-Sciences_html/PELCO-FlipScribe.aspx PELCO Flip-Scribe] |
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Latest revision as of 07:57, 13 December 2022
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About
The Flip-Scribe is a manual scribe+break cleaving system, with a diamond tip that scribes along the underside of the part/wafer. The user manually drags the part across the diamond scribe, using the guides and stops to push the part in a controlled, straight line. Manual breaking tools are provided to perform the break after scribing.
Can scribe/break ~350µm thick sapphire wafers. Thicker/more difficult to cleave parts should be thinned down on the Allied Polisher before cleaving.
Detailed Specifications
- Wafer/Parts Sizes: 4" down to ~10mm
- Digital microscope w/ laptop for finer alignment
- ~100µm alignment accuracy
Operating Procedures
- Flipscribe SOP - To be added
Recipes
- Recipes > Packaging > To Be Added
Be sure to also see the recipes for protecting your sample from dicing dust on the Packaging Recipes page.