Difference between revisions of "Wafer Bonder (SUSS SB6-8E)"

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|picture=WaferBonder.jpg
 
|picture=WaferBonder.jpg
 
|type = Thermal Processing
 
|type = Thermal Processing
|super= Don Freeborn
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|super= Lee Sawyer
 
|phone=(805)839-3918x216
 
|phone=(805)839-3918x216
 
|location=Bay 7
 
|location=Bay 7

Latest revision as of 10:52, 15 April 2020

Wafer Bonder (SUSS SB6-8E)
WaferBonder.jpg
Tool Type Thermal Processing
Location Bay 7
Supervisor Lee Sawyer
Supervisor Phone (805) 893-2123
Supervisor E-Mail lee_sawyer@ucsb.edu
Description Karl Suss Substrate Bonder
Manufacturer Karl Suss America
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About

This is Karl-Suss model SB-6 substrate bonder. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for aligned bonding. Forces up to 20 kN for a 150 mm wafer size are available. The system supports thermal compression as well as anodic bonding (up to 2000 V). The system is computer controlled with a windows environment allowing for multiple recipe steps and saving of recipes and data. The system is configured for manual loading of wafers.

Detailed Specifications

  • Wafer bonding from 50°C to 550°C, +/- 5 degrees accuracy, +/- 3% uniformity
  • Upper and lower heating of samples
  • 5e-5 to 3e3 Torr environment bonding pressure, with Nitrogen
  • Sample size: pieces to 6” wafers, aligned bonding by using MA/BA-6 aligner
  • Anodic bonding to 2000 V
  • Windows-based computer control
  • Wafer bonder currently set up for 4" wafers