Difference between revisions of "Wafer Bonder (SUSS SB6-8E)"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(Created page with "{{tool|{{PAGENAME}} |picture=WaferBonder.jpg |type = Lithography |super= Don Freeborn |phone=(805)839-3918x216 |location=Bay 7 |email=freeborn@ece.ucsb.edu |description = Karl Su…")
Line 1: Line 1:
|type = Lithography
|type = Packaging
|super= Don Freeborn
|super= Don Freeborn

Revision as of 07:02, 11 July 2012

Wafer Bonder (SUSS SB6-8E)
Tool Type Packaging
Location Bay 7
Supervisor Don Freeborn
Supervisor Phone (805) 893-7975
Supervisor E-Mail dfreeborn@ece.ucsb.edu
Description Karl Suss Substrate Bonder
Manufacturer Karl Suss America


This is Karl-Suss model SB-6 substrate bonder. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for aligned bonding. Forces up to 20 kN for a 150 mm wafer size are available. The system supports thermal compression as well as anodic bonding (up to 2000 V). The system is computer controlled with a windows environment allowing for multiple recipe steps and saving of recipes and data. The system is configured for manual loading of wafers.

Detailed Specifications

  • Wafer bonding from 50°C to 550°C, +/- 5 degrees accuracy, +/- 3% uniformity
  • Upper and lower heating of samples
  • 5e-5 to 3e3 Torr environment bonding pressure, with Nitrogen
  • Sample size: pieces to 6” wafers, aligned bonding by using MA/BA-6 aligner
  • Anodic bonding to 2000 V
  • Windows-based computer control