Wafer Bonder (Logitech WBS7)

From UCSB Nanofab Wiki
Revision as of 21:41, 18 September 2018 by John d (talk | contribs) (added crummy scheamtic picture from manual)
Jump to navigation Jump to search
Wafer Bonder (Logitech WBS7)
Tool Type Thermal Processing
Location Bay 5
Supervisor Don Freeborn
Supervisor Phone (805) 893-7975
Supervisor E-Mail dfreeborn@ece.ucsb.edu
Description Wafer Bonder WSB7
Manufacturer Logitech


About

Detailed Specifications

Operation Procedures