Difference between revisions of "Wafer Bonder (Logitech WBS7)"
Jump to navigation
Jump to search
(added crummy scheamtic picture from manual) |
(added link to recipes, short About statement.) |
||
Line 9: | Line 9: | ||
|manufacturer = Logitech |
|manufacturer = Logitech |
||
}} |
}} |
||
− | = About = |
+ | == About == |
+ | This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax. This can be used for through-etching of the sample wafer, for dicing, or sometimes for lithography. |
||
⚫ | |||
⚫ | |||
⚫ | |||
+ | == Recipes == |
||
⚫ | |||
+ | * Recipes > Packaging Recipes > [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)] |
Revision as of 09:14, 16 October 2018
|
About
This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax. This can be used for through-etching of the sample wafer, for dicing, or sometimes for lithography.
Detailed Specifications
Operation Procedures
Recipes
- Recipes > Packaging Recipes > Wafer Bonder (Logitech WBS7)