Difference between revisions of "Wafer Bonder (Logitech WBS7)"

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|type = Thermal Processing
 
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|super= Don Freeborn

Revision as of 15:20, 22 August 2018

Wafer Bonder (Logitech WBS7)
[[image:|300x350px|center|]]
Tool Type Thermal Processing
Location Bay 5
Supervisor Don Freeborn
Supervisor Phone (805) 893-7975
Supervisor E-Mail dfreeborn@ece.ucsb.edu
Description Wafer Bonder WSB7
Manufacturer Logitech


About

Detailed Specifications

Operation Procedures

Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Wafer_Bonder_(Logitech_WBS7)&oldid=155413"