Difference between revisions of "Vacuum Deposition Recipes"

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{{Recipe Table Explanation}}
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===[[Process Group - Process Control Data#Deposition .28Process Control Data.29|<u>Process Control Data</u>]]===
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<small>''See [[Process Group - Process Control Data#Deposition .28Process Control Data.29|linked page]] for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.''</small>
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===Deposition Tools/Materials Table===
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*<small>'''R''': ''Recipe is available. Clicking this link will take you to the recipe.''</small>
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*<small>'''A''': ''Material is available for use, but no recipes are provided.''</small>
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| bgcolor="#eeffff" |[[Sputtering Recipes|A]]
 
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| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Sputter 4 (AJA ATC 2200-V)}}
 
| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Sputter 4 (AJA ATC 2200-V)}}
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| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Sputter 3 (AJA ATC 2000-F)}}
 
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| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Ti-Au Deposition (Sputter 4)}}
 
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| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Sputter 5 (AJA ATC 2200-V)}}
 
| bgcolor="#eeffff" |<br>[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|A]]
 
| bgcolor="#eeffff" |<br>[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|A]]
 
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Latest revision as of 15:44, 7 July 2022

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

  • R: Recipe is available. Clicking this link will take you to the recipe.
  • A: Material is available for use, but no recipes are provided.
Vacuum Deposition Recipes

E-Beam Evaporation Sputtering Thermal Evaporation Plasma Enhanced Chemical
Vapor Deposition (PECVD)
Atomic Layer Deposition Molecular Vapor Deposition
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(AJA ATC 2000-F)
Sputter 4
(AJA ATC 2200-V)
Sputter 5 (AJA ATC 2200-V) Ion Beam
Deposition (Veeco Nexus)
Thermal
Evap 1
Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790)
PECVD 2
(Advanced Vacuum)
Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAL) Molecular Vapor Deposition (Tool)
Ag A
A A A A








Al A
A A A R

A
A A




Al2O3 A A

A R
R




R
AlN



A A
A




R
Au A
A A A R

A A




B














C R
CeO2
R












Co A

A R









Cr A

A R


A A




Cu A


R A








Fe A

A R









Ge A
A A A A








GeO2 A
Gd A

A










Hf A













HfO2



A A






R
In








A




Ir A













ITO
R

A A
A






MgF2 A A
MgO A
Mo A


R A








Nb A



R








Nd



A








Ni A
A A R


A A




NiCr A A
NiFe A A A
Pd A
A A



A A




Pt A
A A A R R





R
Ru A

A
R






R
Si
A

R A

A



R

SiN



R A
R

R R R

SiN - Low Stress R R R
SiO2 A A

R A A R

R R R R
SiOxNy






R

R



Sn








A




SrF2
A












Ta A


R A

A







Ta2O5


A


R






Ti A
A A R R R
A







TiN




R
A




R
TiW A


A R








TiO2
A

A R
R




R
V



A A








W A


A R








Zn







A A




ZnO












R
Zr A

A A A








ZrO2












R
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(ATC 2000-F)
Sputter 4
(ATC 2200-V)
Sputter 5 (ATC 2200-V) Ion Beam
Deposition (Veeco Nexus)
Thermal
Evap 1
Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790)
PECVD 2
(Advanced Vacuum)
Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAl) Molecular Vapor Deposition (Tool)