Difference between revisions of "Vacuum Deposition Recipes"

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===[[Process Group - Process Control Data#Deposition .28Process Control Data.29|<u>Process Control Data</u>]]===
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{{Recipe Table Explanation}}
  
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<small>''See [[Process Group - Process Control Data#Deposition .28Process Control Data.29|linked page]] for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.''</small>
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===Deposition Tools/Materials Table===
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*<small>'''R''': ''Recipe is available. Clicking this link will take you to the recipe.''</small>
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*<small>'''A''': ''Material is available for use, but no recipes are provided.''</small>
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| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29|Sputter 3<br>(AJA ATC 2000-F)]]
  
| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29|Sputter 3<br>(AJA ATC 2000-F)]]
 
| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(AJA ATC 2200-V)]]
  
| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(AJA ATC 2200-V)]]
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| width="65" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/wiki/index.php/Sputtering_Recipes#Sputter_5_.28AJA_ATC_2200-V.29 Sputter 5 (AJA ATC 2200-V)]
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| width="65" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_5_.28AJA_ATC_2200-V.29 Sputter 5 (AJA ATC 2200-V)]
 
| width="55" bgcolor="#daf1ff" |[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Veeco Nexus)]]
  
| width="55" bgcolor="#daf1ff" |[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Veeco Nexus)]]
 
| width="45" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]]
  
| width="45" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]]
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| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Al2O3 Deposition (Sputter 4)}}
  
| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Al2O3 Deposition (Sputter 4)}}
 
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| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/wiki/index.php/Sputtering_Recipes#Al2O3_deposition_.28IBD.29 R]
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| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Al2O3_deposition_.28IBD.29 R]
 
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|[https://wiki.nanotech.ucsb.edu/wiki/index.php/Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29 R]
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|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29 R]
 
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| bgcolor="#eeffff" |[[Sputtering Recipes|A]]
  
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| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Sputter 4 (AJA ATC 2200-V)}}
  
| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Sputter 4 (AJA ATC 2200-V)}}
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| bcolor="EEFFFF" |{{rl|Sputtering Recipes|Sputter 5 (AJA ATC 2200-V)}}
 
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|[[Sputtering Recipes#Ru Deposition .28Sputter 4.29|R]]
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| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/wiki/index.php/PECVD_Recipes#Amorphous-Si_deposition_.28PECVD_.232.29 R]
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| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=PECVD_Recipes#Amorphous-Si_deposition_.28PECVD_.232.29 R]
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| bgcolor="#eeffff" |[[PECVD_Recipes#Amorphous_Si_.28100.25SiH4_Ar_He.29|R]]
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|{{rl|PECVD Recipes|SiN deposition (PECVD #1)}}
  
|{{rl|PECVD Recipes|SiN deposition (PECVD #1)}}
 
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|{{rl|PECVD Recipes|SiN deposition (PECVD #2)}}
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|{{rl|PECVD Recipes|SiN 250C deposition (Unaxis VLR)}}
 
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! bgcolor="#d0e7ff" align="center" |SiN - Low Stress
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|{{rl|PECVD Recipes|Low-Stress SiN - LS-SiN (PECVD#1)}}
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! bgcolor="#d0e7ff" align="center" |SiO<sub>2</sub>
  
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| bgcolor="#eeffff" |{{rl|PECVD Recipes|SiO2 deposition (PECVD #1)}}
  
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| bgcolor="#eeffff" |{{rl|PECVD Recipes|SiO2 LDR 250C Deposition (Unaxis VLR)}}
 
| bgcolor="#eeffff" |{{rl|Atomic Layer Deposition Recipes|SiO2 deposition (ALD CHAMBER 3)}}
  
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|[https://wiki.nanotech.ucsb.edu/wiki/index.php/Sputtering_Recipes#SiOxNy_deposition_.28IBD.29 A]
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|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#SiOxNy_deposition_.28IBD.29 R]
 
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| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Sputter 3 (AJA ATC 2000-F)}}
  
| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Sputter 3 (AJA ATC 2000-F)}}
 
| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Ti-Au Deposition (Sputter 4)}}
  
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| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Sputter 5 (AJA ATC 2200-V)}}
 
| bgcolor="#eeffff" |<br>[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|A]]
  
| bgcolor="#eeffff" |<br>[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|A]]
 
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|[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29 R]
 
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|[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|A]]
  
|[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|A]]

Latest revision as of 15:44, 7 July 2022

Process Control Data

See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.

Deposition Tools/Materials Table

  • R: Recipe is available. Clicking this link will take you to the recipe.
  • A: Material is available for use, but no recipes are provided.
Vacuum Deposition Recipes

 E-Beam Evaporation Sputtering Thermal Evaporation Plasma Enhanced Chemical
Vapor Deposition (PECVD) 		Atomic Layer Deposition Molecular Vapor Deposition
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(AJA ATC 2000-F) 		Sputter 4
(AJA ATC 2200-V) 		Sputter 5 (AJA ATC 2200-V) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAL) Molecular Vapor Deposition (Tool)
Ag A
A A A A








Al A
A A A R

A 		A A




Al2O3 A A

A R
R




R
AlN



A A
A




R
Au A
A A A R

A A




B














C R
CeO2
R












Co A

A R









Cr A

A R


A A




Cu A


R A








Fe A

A R









Ge A
A A A A








GeO2 A
Gd A

A










Hf A













HfO2



A A






R
In








A




Ir A













ITO
R

A A
A






MgF2 A A
MgO A
Mo A


R A








Nb A



R








Nd



A








Ni A
A A R


A A




NiCr A A
NiFe A A A
Pd A
A A



A A




Pt A
A A A R R





R
Ru A

A
R






R
Si
A

R A

A


R

SiN



R A
R

R R R

SiN - Low Stress R R R
SiO2 A A

R A A R

R R R R
SiOxNy






R

R



Sn








A




SrF2
A












Ta A


R A

A






Ta2O5


A


R






Ti A
A A R R R
A






TiN




R
A




R
TiW A


A R








TiO2
A

A R
R




R
V



A A








W A


A R








Zn







A A




ZnO












R
Zr A

A A A








ZrO2












R
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 3
(ATC 2000-F) 		Sputter 4
(ATC 2200-V) 		Sputter 5 (ATC 2200-V) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAl) Molecular Vapor Deposition (Tool)
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Vacuum_Deposition_Recipes&oldid=160126"