Difference between revisions of "Tool List"
Jump to navigation
Jump to search
| Line 60: | Line 60: | ||
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]] |
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]] |
||
*[[Ashers (Technics PEII)]] |
*[[Ashers (Technics PEII)]] |
||
| − | *[[ |
+ | *[[UV Ozone Reactor]] |
| − | |||
| width="400" | |
| width="400" | |
||
*[[ICP Etch 1 (Panasonic E626I)]] |
*[[ICP Etch 1 (Panasonic E626I)]] |
||
*[[ICP Etch 2 (Panasonic E640)]] |
*[[ICP Etch 2 (Panasonic E640)]] |
||
| − | *[[ |
+ | *[[ICP-Etch (Unaxis VLR)]] |
*[[Plasma Clean (Gasonics 2000)]] |
*[[Plasma Clean (Gasonics 2000)]] |
||
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
||
Revision as of 07:51, 11 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Dicing Saw (ADT)
- Wire Saw (Takatori)
- Wafer Bonder (SUSS SB6-8E)