Difference between revisions of "Tool List"
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| Line 98: | Line 98: | ||
=Packaging= |
=Packaging= |
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| − | * [[Flip-Chip Bonder]] |
+ | * [[Flip-Chip Bonder (Finetech)]] |
* [[Vacuum Sealer]] |
* [[Vacuum Sealer]] |
||
| − | * [[Dicing Saw]] |
+ | * [[Dicing Saw (ADT)]] |
| + | * [[Wire Saw (Takatori)]] |
||
=Inspection, Test and Characterization= |
=Inspection, Test and Characterization= |
||
Revision as of 12:57, 28 June 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
Inspection, Test and Characterization
- Field Emission SEM 1
- Field Emission SEM 2
- Step Profile
- Step Profilometer
- Ellipsometer
- Microscopes
- Probe Station & Curve Tracer
- Optical Film Thickness (Filmetrics)
- Scanning Probe Microscope
- Tencor Flexus Film Stress
- Optical Film Thickness (Nanometric)
- SEM Sample Coater
- Surface Analysis
- Photo-emission & IR Microscope
- Ellipsometer (Woollam)
- Goniometer
- 4-Point Probe Resistivity Mapper