Difference between revisions of "Tool List"

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*[[Deep UV Optical Microscope (Olympus)]]
 
*[[Deep UV Optical Microscope (Olympus)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
 
 
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
 
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
  
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*[[Resistivity Mapper (CDE RESMAP)]]
 
*[[Resistivity Mapper (CDE RESMAP)]]
 
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
 
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
 +
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
  
 
======Other Properties======
 
======Other Properties======

Revision as of 13:17, 2 September 2022

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties