Difference between revisions of "Tool List"

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(→‎Inspection, Test and Characterization: rearranged, moved "other properties" to end, renamed "Surfscan" to "particle counts")
(→‎Packaging: added sub-categories, Linked to new LatticeAx tool)
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**[[Vacuum Oven (YES)]]
 
**[[Vacuum Oven (YES)]]
 
**[[High Temp Oven (Blue M)]]
 
**[[High Temp Oven (Blue M)]]
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=Packaging=
 
=Packaging=
 +
{|
 +
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==== Die Singulation / Down-sizing ====
  
 
*[[Dicing Saw (ADT)]]
 
*[[Dicing Saw (ADT)]]
*[[Flip-Chip Bonder (Finetech)]]
+
*[[Wafer Cleaver (PELCO LatticeAx)]]
 +
 
 +
==== Other Packaging ====
 +
 
 
*[[Vacuum Sealer]]
 
*[[Vacuum Sealer]]
 +
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 +
==== Wafer/Die Bonding ====
 +
 +
* [[Flip-Chip Bonder (Finetech)]]
 +
 +
*[[Wafer Bonder (SUSS SB6-8E)]]
 +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
 +
|}
  
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
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*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
 
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
  
====== Other Properties ======
+
======Other Properties======
  
 
*[[Film Stress (Tencor Flexus)]]
 
*[[Film Stress (Tencor Flexus)]]
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*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
 
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
 
**''Surface hydrophobicity''
 
**''Surface hydrophobicity''
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Revision as of 08:20, 1 March 2022

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties