Difference between revisions of "Tool List"
Jump to navigation
Jump to search
| Line 75: | Line 75: | ||
|-valign="top" | |-valign="top" | ||
|width=300| | |width=300| | ||
| + | * [[Gold Plating Bench]] | ||
| + | * [[Critical Point Dryer]] | ||
| + | * [[Spin Rinse Dryer (SemiTool)]] | ||
| + | * [[Chemical-Mechanical Polisher (Logitech)]] | ||
| + | |width=400| | ||
* [[Wet Benches]] | * [[Wet Benches]] | ||
**[[Solvent Cleaning Benches]] | **[[Solvent Cleaning Benches]] | ||
| Line 82: | Line 87: | ||
**[[HF/TMAH Processing Benches]] | **[[HF/TMAH Processing Benches]] | ||
**[[Plating Bench]] | **[[Plating Bench]] | ||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
|- | |- | ||
|} | |} | ||
Revision as of 15:49, 16 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Dicing Saw (ADT)
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Wafer Bonder (SUSS SB6-8E)
- Wire Saw (Takatori)