Difference between revisions of "Tool List"
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=Lithography= | =Lithography= | ||
{| | {| | ||
| − | |-valign="top" | + | |-valign="top" |
|width=300| | |width=300| | ||
* [[Suss Aligners (SUSS MJB-3)]] | * [[Suss Aligners (SUSS MJB-3)]] | ||
* [[IR Aligner (SUSS MJB-3 IR)]] | * [[IR Aligner (SUSS MJB-3 IR)]] | ||
| − | * [[DUV Flood | + | * [[DUV Flood Expsaad3 (Labline)]] |
| − | |||
* [[Oven 4 (Fisher)]] | * [[Oven 4 (Fisher)]] | ||
* [[High Temp Oven (Blue M)]] | * [[High Temp Oven (Blue M)]] | ||
Revision as of 15:48, 16 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Dicing Saw (ADT)
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Wafer Bonder (SUSS SB6-8E)
- Wire Saw (Takatori)