Difference between revisions of "Tool List"
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*[[Thermal Evap 1]] |
*[[Thermal Evap 1]] |
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*[[Thermal Evap 2 (Solder)]] |
*[[Thermal Evap 2 (Solder)]] |
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− | *[[ |
+ | *[[ICP-PECVD (Unaxis VLR)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
||
*[[Molecular Vapor Deposition]] |
*[[Molecular Vapor Deposition]] |
Revision as of 07:48, 11 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Dicing Saw (ADT)
- Wire Saw (Takatori)
- Wafer Bonder (SUSS SB6-8E)