Difference between revisions of "Tool List"

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(→‎Packaging: added sub-categories, Linked to new LatticeAx tool)
(→‎Die Singulation / Down-sizing: changed name to Flipscribe from LatticeAx. LatticeAx is a different product)
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{|
 
{|
 
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==== Die Singulation / Down-sizing ====
+
====Die Singulation / Down-sizing====
  
 
*[[Dicing Saw (ADT)]]
 
*[[Dicing Saw (ADT)]]
*[[Wafer Cleaver (PELCO LatticeAx)]]
+
*[[Wafer Cleaver (PELCO LatticeAx)|Wafer Cleaver (PELCO Flipscribe)]]
  
==== Other Packaging ====
+
====Other Packaging====
  
 
*[[Vacuum Sealer]]
 
*[[Vacuum Sealer]]
 
|
 
|
==== Wafer/Die Bonding ====
+
====Wafer/Die Bonding====
  
* [[Flip-Chip Bonder (Finetech)]]
+
*[[Flip-Chip Bonder (Finetech)]]
  
 
*[[Wafer Bonder (SUSS SB6-8E)]]
 
*[[Wafer Bonder (SUSS SB6-8E)]]

Revision as of 11:11, 1 March 2022

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties