Difference between revisions of "Tool List"

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(→‎Wet Processing: link to Wafer_Toxic_Corrosive_Bench)
 
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Line 40: Line 40:
 
*[[Oven 5 (Labline)]]
 
*[[Oven 5 (Labline)]]
 
*[[High Temp Oven (Blue M)]]
 
*[[High Temp Oven (Blue M)]]
*[[Vacuum Oven (YES)]]
 
  
 
=====Lithography Support=====
 
=====Lithography Support=====
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|- valign="top"
 
|- valign="top"
 
| width="300" |
 
| width="300" |
=====Physical Vapor Deposition (PVD)=====
+
====Physical Vapor Deposition (PVD)====
 +
 
 +
=====Thermal Evaporation=====
  
 
*[[E-Beam 1 (Sharon)]]
 
*[[E-Beam 1 (Sharon)]]
Line 70: Line 71:
 
*[[Sputter 5 (AJA ATC 2200-V)]]
 
*[[Sputter 5 (AJA ATC 2200-V)]]
 
*[[Ion Beam Deposition (Veeco NEXUS)]]
 
*[[Ion Beam Deposition (Veeco NEXUS)]]
 +
*[[SEM Sample Coater (Hummer)]]
  
 
| width="400" |
 
| width="400" |
Line 95: Line 97:
 
=====Plasma Etching and Cleaning=====
 
=====Plasma Etching and Cleaning=====
  
*[[Plasma Clean (Gasonics 2000)]]
 
 
*[[Plasma Clean (YES EcoClean)]]
 
*[[Plasma Clean (YES EcoClean)]]
 
*[[Plasma Activation (EVG 810)]]
 
*[[Plasma Activation (EVG 810)]]
Line 118: Line 119:
  
 
*[[CAIBE (Oxford Ion Mill)]]
 
*[[CAIBE (Oxford Ion Mill)]]
 +
*[[Focused Ion-Beam Lithography (Raith Velion)]]
  
 
=====Other Dry Etching=====
 
=====Other Dry Etching=====
Line 137: Line 139:
 
**[[Develop Benches]]
 
**[[Develop Benches]]
 
**[[Toxic Corrosive Benches]]
 
**[[Toxic Corrosive Benches]]
 +
**[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]]
 
**[[HF/TMAH Processing Benches]]
 
**[[HF/TMAH Processing Benches]]
 
**[[Plating Bench]]
 
**[[Plating Bench]]
Line 166: Line 169:
 
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
 
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
 
**[[Oven 5 (Labline)]]
 
**[[Oven 5 (Labline)]]
**[[Vacuum Oven (YES)]]
 
 
**[[High Temp Oven (Blue M)]]
 
**[[High Temp Oven (Blue M)]]
|
 
 
|-
 
|-
 
|}
 
|}
  
 
=Packaging=
 
=Packaging=
 +
{|
 +
|
 +
====Die Singulation / Down-sizing====
  
 
*[[Dicing Saw (ADT)]]
 
*[[Dicing Saw (ADT)]]
 +
*[[Wafer Cleaver (PELCO Flip-Scribe)|Wafer Cleaver (PELCO Flipscribe)]]
 +
 +
====Other Packaging====
 +
 +
*[[Vacuum Sealer]]
 +
|
 +
====Wafer/Die Bonding====
 +
 
*[[Flip-Chip Bonder (Finetech)]]
 
*[[Flip-Chip Bonder (Finetech)]]
*[[Vacuum Sealer]]
+
 
 +
*[[Wafer Bonder (SUSS SB6-8E)]]
 +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
 +
|}
  
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
Line 184: Line 199:
 
=====Optical Microscopy=====
 
=====Optical Microscopy=====
  
*[[Microscopes|Optical Microscopes]]
+
*[[Microscopes|Optical Microscopes]] - ''General Use''
 
*[[Fluorescence Microscope (Olympus MX51)]]
 
*[[Fluorescence Microscope (Olympus MX51)]]
 
*[[Deep UV Optical Microscope (Olympus)]]
 
*[[Deep UV Optical Microscope (Olympus)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
 
 
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
 
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
  
Line 202: Line 216:
 
*[[Step Profilometer (Dektak 6M)]]
 
*[[Step Profilometer (Dektak 6M)]]
 
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
 
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
*[[Surface Analysis (KLA/Tencor Surfscan)]]
 
**''Sub-micron Particle Counter''
 
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
| width="400" |
 
| width="400" |
Line 211: Line 223:
  
 
*[[Ellipsometer (Woollam)]]
 
*[[Ellipsometer (Woollam)]]
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
 
 
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
 
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
*[[Optical Film Thickness (Nanometric)]]
 
 
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
 
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
 
======Other Properties======
 
 
*[[Film Stress (Tencor Flexus)]]
 
*[[Photoluminescence PL Setup (Custom)]]
 
  
 
======Electrical Analysis======
 
======Electrical Analysis======
  
 
*[[Resistivity Mapper (CDE RESMAP)]]
 
*[[Resistivity Mapper (CDE RESMAP)]]
*[[Probe Station & Curve Tracer]]
+
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
 +
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
  
=====Other Tools=====
+
======Other Properties======
  
 +
*[[Film Stress (Tencor Flexus)]]
 +
*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
 +
*[[Photoluminescence PL Setup (Custom)]]
 
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
 
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
 
**''Surface hydrophobicity''
 
**''Surface hydrophobicity''
|-
 
|
 
|
 
 
|-
 
|-
 
|}
 
|}

Latest revision as of 21:52, 1 October 2022

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties