Difference between revisions of "Tool List"

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=====Photoresists and Lithography Chemicals=====
 
=====Photoresists and Lithography Chemicals=====
  
*See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
+
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  
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*[[Suss Aligners (SUSS MJB-3)]]
 
*[[Suss Aligners (SUSS MJB-3)]]
*[[IR Aligner (SUSS MJB-3 IR)]]
 
 
*[[Contact Aligner (SUSS MA-6)]]
 
*[[Contact Aligner (SUSS MA-6)]]
 
*[[DUV Flood Expose]]
 
*[[DUV Flood Expose]]
 +
 +
=====Direct-Write Lithography=====
 +
 +
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
 +
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
 +
*[[Focused Ion-Beam Lithography (Raith Velion)]]
 +
*[[Maskless Aligner (Heidelberg MLA150)]]
  
 
=====Other Patterning Systems=====
 
=====Other Patterning Systems=====
  
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
 
*[[Nano-Imprint (Nanonex NX2000)]]
 
 
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 
| width="400" |
 
| width="400" |
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=====Lithography Support=====
 
=====Lithography Support=====
  
*The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
+
*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
+
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
 
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
|-
 
|-
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*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP-Etch (Unaxis VLR)]]
 
*[[ICP-Etch (Unaxis VLR)]]
 +
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
 
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
 
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
 
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
 
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
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*[[Spin Rinse Dryer (SemiTool)]]
 
*[[Spin Rinse Dryer (SemiTool)]]
 
*[[Chemical-Mechanical Polisher (Logitech)]]
 
*[[Chemical-Mechanical Polisher (Logitech)]]
 +
*[[Mechanical Polisher (Allied)]]
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
+
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 
|-
 
|-
 
|}
 
|}
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*[[Wafer Bonder (SUSS SB6-8E)]]
 
*[[Wafer Bonder (SUSS SB6-8E)]]
 
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
 
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
*Solaris SSI RTP
 
 
| width="400" |
 
| width="400" |
 
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
 
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
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*[[Flip-Chip Bonder (Finetech)]]
 
*[[Flip-Chip Bonder (Finetech)]]
 
*[[Vacuum Sealer]]
 
*[[Vacuum Sealer]]
*[[Wire Saw (Takatori)]]
 
  
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
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|- valign="top"
 
|- valign="top"
 
| width="300" |
 
| width="300" |
=====Optical/Electron Microscopy=====
+
=====Optical Microscopy=====
  
 
*[[Microscopes|Optical Microscopes]]
 
*[[Microscopes|Optical Microscopes]]
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
 
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
 +
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
 +
 +
=====Electron Microscopy=====
 +
 
*[[Field Emission SEM 1 (FEI Sirion)]]
 
*[[Field Emission SEM 1 (FEI Sirion)]]
 
*[[Field Emission SEM 2 (JEOL 7600F)]]
 
*[[Field Emission SEM 2 (JEOL 7600F)]]
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
| width="400" |
 
| width="400" |
=====Thin-Film Analysis/Measurement=====
+
=====Thin-Film/Material Analysis=====
 +
 
 +
======Thickness + Optical Constants======
  
 
*[[Ellipsometer (Woollam)]]
 
*[[Ellipsometer (Woollam)]]
*[[Film Stress (Tencor Flexus)]]
+
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
 
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
 
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
+
*[[Optical Film Thickness (Nanometric)]]
 
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
 
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
*[[Optical Film Thickness (Nanometric)]]
+
 
 +
======Other Properties======
 +
 
 +
*[[Film Stress (Tencor Flexus)]]
 +
*[[Photoluminescence PL Setup (Custom)]]
 +
 
 +
======Electrical Analysis======
 +
 
 
*[[Resistivity Mapper (CDE RESMAP)]]
 
*[[Resistivity Mapper (CDE RESMAP)]]
 +
*[[Probe Station & Curve Tracer]]
  
 
=====Other Tools=====
 
=====Other Tools=====
  
*[[Probe Station & Curve Tracer]]
+
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
*[[Goniometer]]
+
**''Surface hydrophobicity''
*[[Photoluminescence PL Setup (Custom)]]
+
|-
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 +
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|-
 
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Latest revision as of 09:15, 28 October 2021

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Other Properties
Electrical Analysis
Other Tools