Latest revision as of 11:52, 1 March 2024

Lithography

Photoresists and Lithography Chemicals

See the Chemical Datasheets page.
Auto. Coat/Develop (S-Cubed Flexi)

Contact Aligners (Optical Exposure)

Direct-Write Lithography

Other Patterning Systems

Holographic Litho/PL Setup (Custom)

Steppers (Optical Exposure)

Thermal Processing for Photolithography

Lithography Support

The Spinner Benches have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
POLOS spinners on Develop and Solvent benches
Spin/Rinse/Dryer

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation

Sputter Deposition

Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)

Plasma Etching and Cleaning

Etch Monitoring

Laser Etch Monitoring (Endpoint Detection)
Optical Emission Spectra
Residual Gas Analyzer (RGA)

ICP-RIE

Ion Milling and Reactive Ion Beam Etching

Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Wet Benches

Thermal Processing

Ovens - Overview of all Lab Ovens

Packaging

Back-end Fabrication Tools

Die Singulation / Down-sizing

Other Packaging

Vacuum Sealer

Wafer/Die Bonding

Flip-Chip Bonder (Finetech)

Measurement & Characterization

Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools

@@ Line 7: / Line 7: @@
 =====Photoresists and Lithography Chemicals=====
-*See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
+*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
 *[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 =====Contact Aligners (Optical Exposure)=====
-*[[Suss Aligners (SUSS MJB-3)]]
+*[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]]
-*[[IR Aligner (SUSS MJB-3 IR)]]
 *[[Contact Aligner (SUSS MA-6)]]
 *[[DUV Flood Expose]]
-=====Other Patterning Systems=====
+=====Direct-Write Lithography=====
 *[[E-Beam Lithography System (JEOL JBX-6300FS)]]
+*[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]]
-*[[Nano-Imprint (Nanonex NX2000)]]
+*[[Focused Ion-Beam Lithography (Raith Velion)]]
+*[[Maskless Aligner (Heidelberg MLA150)]]
+=====Other Patterning Systems=====
 *[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 | width="400" |
@@ Line 36: / Line 40: @@
 *[[Oven 5 (Labline)]]
 *[[High Temp Oven (Blue M)]]
-*[[Vacuum Oven (YES)]]
 =====Lithography Support=====
-*The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
+*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
-*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
+*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
 *[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 |-
@@ Line 51: / Line 54: @@
 |- valign="top"
 | width="300" |
-=====Physical Vapor Deposition (PVD)=====
+====Physical Vapor Deposition (PVD)====
+=====Thermal Evaporation=====
 *[[E-Beam 1 (Sharon)]]
@@ Line 57: / Line 62: @@
 *[[E-Beam 3 (Temescal)]]
 *[[E-Beam 4 (CHA)]]
+*[[E-Beam 5 (Plasys)]]
 *[[Thermal Evap 1]]
 *[[Thermal Evap 2 (Solder)]]
@@ Line 66: / Line 72: @@
 *[[Sputter 5 (AJA ATC 2200-V)]]
 *[[Ion Beam Deposition (Veeco NEXUS)]]
+*[[SEM Sample Coater (Hummer)]]
 | width="400" |
@@ Line 88: / Line 95: @@
 *[[RIE 3 (MRC)]]
 *[[RIE 5 (PlasmaTherm)]]
-*[[Ashers (Technics PEII)]]
-*[[Plasma Clean (Gasonics 2000)]]
+=====Plasma Etching and Cleaning=====
 *[[Plasma Clean (YES EcoClean)]]
 *[[Plasma Activation (EVG 810)]]
-*[[CAIBE (Oxford Ion Mill)]]
+*[[Ashers (Technics PEII)]]
 =====Etch Monitoring=====
@@ Line 102: / Line 110: @@
 =====ICP-RIE=====
-*[[ICP Etch 1 (Panasonic E626I)]]
+*[[ICP Etch 1 (Panasonic E646V)]]
-*[[ICP Etch 2 (Panasonic E640)]]
+*[[ICP Etch 2 (Panasonic E626I)]]
 *[[ICP-Etch (Unaxis VLR)]]
+*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
 *[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
 *[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
+=====Ion Milling and Reactive Ion Beam Etching=====
+*[[CAIBE (Oxford Ion Mill)]]
+*[[Focused Ion-Beam Lithography (Raith Velion)]]
 =====Other Dry Etching=====
@@ Line 126: / Line 140: @@
 **[[Develop Benches]]
 **[[Toxic Corrosive Benches]]
+**[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]]
 **[[HF/TMAH Processing Benches]]
 **[[Plating Bench]]
@@ Line 133: / Line 148: @@
 *[[Spin Rinse Dryer (SemiTool)]]
 *[[Chemical-Mechanical Polisher (Logitech)]]
+*[[Mechanical Polisher (Allied)]]
 *[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
-*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
+*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 |-
 |}
@@ Line 154: / Line 170: @@
 **[[Oven 4 (Thermo-Fisher HeraTherm)]]
 **[[Oven 5 (Labline)]]
-**[[Vacuum Oven (YES)]]
 **[[High Temp Oven (Blue M)]]
 |-
@@ Line 160: / Line 175: @@
 =Packaging=
+''Back-end Fabrication Tools''
+{|
+|
+====Die Singulation / Down-sizing====
 *[[Dicing Saw (ADT)]]
+*[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]]
-*[[Flip-Chip Bonder (Finetech)]]
+*[[Automated Wafer Cleaver (Loomis LSD-155LT)]]
+====Other Packaging====
 *[[Vacuum Sealer]]
+|
-*[[Wire Saw (Takatori)]]
+====Wafer/Die Bonding====
+*[[Flip-Chip Bonder (Finetech)]]
+*[[Wafer Bonder (SUSS SB6-8E)]]
+*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
+|}
-=Inspection, Test and Characterization=
+=Measurement & Characterization=
+''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools''
 {|
 |- valign="top"
 | width="300" |
-=====Optical/Electron Microscopy=====
+=====Optical Microscopy=====
-*[[Microscopes|Optical Microscopes]]
+*[[Microscopes|Optical Microscopes]] - ''General Use''
 *[[Fluorescence Microscope (Olympus MX51)]]
 *[[Deep UV Optical Microscope (Olympus)]]
 *[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
-*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
+*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
+*[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]]
-*[[Field Emission SEM 1 (FEI Sirion)]]
-*[[Field Emission SEM 2 (JEOL 7600F)]]
+=====Electron Microscopy=====
+*[[SEM 1 (JEOL IT800SHL)]]
+*[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]]
 *[[SEM Sample Coater (Hummer)]]
@@ Line 184: / Line 219: @@
 *[[Step Profilometer (KLA Tencor P-7)]]
-*[[Step Profilometer (Dektak 6M)]]
+*[[Step Profilometer (DektakXT)]]
 *[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
-*[[Surface Analysis (KLA/Tencor Surfscan)]]
-**''Sub-micron Particle Counter''
 *[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
-*[[Optical Profilometer - White-Light/Phase-Shift Interference (Filmetrics Profilm3D)]]
 | width="400" |
-=====Thin-Film Analysis/Measurement=====
+=====Thin-Film/Material Analysis=====
+======Thickness + Optical Constants======
 *[[Ellipsometer (Woollam)]]
-*[[Film Stress (Tencor Flexus)]]
 *[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
-*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
 *[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 *[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
-*[[Optical Film Thickness (Nanometric)]]
+======Electrical Analysis======
 *[[Resistivity Mapper (CDE RESMAP)]]
+*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
+*[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
-=====Other Tools=====
+======Other Properties======
-*[[Probe Station & Curve Tracer]]
+*[[Film Stress (Tencor Flexus)]]
+*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
-*[[Goniometer]]
 *[[Photoluminescence PL Setup (Custom)]]
 |-

Difference between revisions of "Tool List"