Difference between revisions of "Tool List"

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__NOTOC__
 
__NOTOC__
 
=Lithography=
 
=Lithography=
  +
* [[Suss Aligners]]
 
  +
{|
* [[IR Aligner]]
 
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|- valign="top"
* [[DUV Flood Expose]]
 
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| width="300" |
* [[Ovens]]
 
  +
=====Photoresists and Lithography Chemicals=====
* [[Stepper 1]]
 
  +
* [[Stepper 2]]
 
  +
*See the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
* [[Stepper 3]]
 
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
* [[E-Beam Lithography System]]
 
  +
  +
=====Contact Aligners (Optical Exposure)=====
  +
  +
*[[Suss Aligners (SUSS MJB-3)]]
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*[[IR Aligner (SUSS MJB-3 IR)]]
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*[[Contact Aligner (SUSS MA-6)]]
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*[[DUV Flood Expose]]
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  +
=====Other Patterning Systems=====
  +
  +
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
  +
*[[Nano-Imprint (Nanonex NX2000)]]
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*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
  +
| width="400" |
  +
=====Steppers (Optical Exposure)=====
  +
  +
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
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*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
  +
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
  +
  +
=====Thermal Processing for Photolithography=====
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  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
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*[[Ovens 1, 2 & 3 (Labline)]]
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*[[Oven 4 (Fisher)]]
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*[[Oven 5 (Labline)]]
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*[[High Temp Oven (Blue M)]]
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*[[Vacuum Oven (YES)]]
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  +
=====Lithography Support=====
  +
  +
*The [https://wiki.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
  +
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
  +
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
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|-
  +
|}
   
 
=Vacuum Deposition=
 
=Vacuum Deposition=
  +
* [[E-Beam 1]]
 
  +
{|
* [[E-Beam 2]]
 
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|- valign="top"
* [[E-Beam 3]]
 
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| width="300" |
* [[E-Beam 4]]
 
  +
=====Physical Vapor Deposition (PVD)=====
* [[Sputter 1]]
 
  +
* [[Sputter 2]]
 
* [[Sputter 3]]
+
*[[E-Beam 1 (Sharon)]]
* [[Sputter 4]]
+
*[[E-Beam 2 (Custom)]]
* [[Sputter 5]]
+
*[[E-Beam 3 (Temescal)]]
* [[PECVD 1]]
+
*[[E-Beam 4 (CHA)]]
* [[PECVD 2]]
+
*[[Thermal Evap 1]]
* [[Unaxis VLR ICP-PECVD]]
+
*[[Thermal Evap 2 (Solder)]]
  +
* [[IBD]]
 
* [[Molecular Vapor Deposition]]
+
=====Sputter Deposition=====
  +
* [[Atomic Layer Deposision]]
 
  +
*[[Sputter 3 (AJA ATC 2000-F)]]
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*[[Sputter 4 (AJA ATC 2200-V)]]
  +
*[[Sputter 5 (AJA ATC 2200-V)]]
  +
*[[Ion Beam Deposition (Veeco NEXUS)]]
  +
  +
| width="400" |
  +
=====Chemical Vapor Deposition (CVD)=====
  +
  +
*[[PECVD 1 (PlasmaTherm 790)]]
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*[[PECVD 2 (Advanced Vacuum)]]
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*[[ICP-PECVD (Unaxis VLR)]]
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*[[Molecular Vapor Deposition]]
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*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
  +
  +
|}
   
 
=Dry Etch=
 
=Dry Etch=
  +
* [[RIE 1]]
 
  +
{|
* [[RIE 2]]
 
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|- valign="top"
* [[RIE 3]]
 
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| width="300" |
* [[RIE 5]]
 
  +
=====Reactive Ion Etching (RIE)=====
* [[Si Deep RIE]]
 
  +
* [[Ashers]]
 
* [[VLR Etch]]
+
*[[RIE 2 (MRC)]]
* [[ICP Etch 1]]
+
*[[RIE 3 (MRC)]]
* [[ICP Etch 2]]
+
*[[RIE 5 (PlasmaTherm)]]
  +
* [[UV Ozone Reactor]]
 
  +
=====Plasma Etching and Cleaning=====
* [[Plasma Clean]]
 
  +
* [[XeF2 Etch]]
 
* [[Plasma Activation Tool]]
+
*[[Plasma Clean (Gasonics 2000)]]
  +
*[[Plasma Clean (YES EcoClean)]]
  +
*[[Plasma Activation (EVG 810)]]
  +
*[[Ashers (Technics PEII)]]
  +
  +
=====Etch Monitoring=====
  +
  +
*[[Laser Etch Monitoring]] (Endpoint Detection)
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*Optical Emission Spectra
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*Residual Gas Analyzer (RGA)
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| width="400" |
  +
=====ICP-RIE=====
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  +
*[[ICP Etch 1 (Panasonic E626I)]]
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*[[ICP Etch 2 (Panasonic E640)]]
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*[[ICP-Etch (Unaxis VLR)]]
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*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
  +
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
  +
  +
=====Ion Milling and Reactive Ion Beam Etching=====
  +
  +
*[[CAIBE (Oxford Ion Mill)]]
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  +
=====Other Dry Etching=====
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*[[UV Ozone Reactor]]
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*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
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*[[Vapor HF Etch]]
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  +
|}
   
 
=Wet Processing=
 
=Wet Processing=
  +
See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc.
* [[Wet Benches]]
 
  +
{|
* [[Gold Plating Bench]]
 
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|- valign="top"
* [[Critical Point Dryer]]
 
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| width="300" |
* [[Spin Rinse Dryer]]
 
  +
*[[Wet Benches]]
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**[[Solvent Cleaning Benches]]
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**[[Spin Coat Benches]]
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**[[Develop Benches]]
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**[[Toxic Corrosive Benches]]
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**[[HF/TMAH Processing Benches]]
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**[[Plating Bench]]
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| width="400" |
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*[[Gold Plating Bench]]
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*[[Critical Point Dryer]]
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*[[Spin Rinse Dryer (SemiTool)]]
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*[[Chemical-Mechanical Polisher (Logitech)]]
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*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  +
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
  +
|-
  +
|}
   
 
=Thermal Processing=
 
=Thermal Processing=
  +
{|
* [[Wet Benches]]
 
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|- valign="top"
* [[Gold Plating Bench]]
 
  +
| width="400" |
* [[Critical Point Dryer]]
 
  +
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
* [[Spin Rinse Dryer]]
 
  +
*[[Rapid Thermal Processor (SSI Solaris 150)]]
  +
*[[Tube Furnace (Tystar 8300)]]
  +
*[[Tube Furnace Wafer Bonding (Thermco)]]
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*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
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*[[Wafer Bonder (SUSS SB6-8E)]]
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*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
  +
| width="400" |
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
  +
**[[Ovens 1, 2 & 3 (Labline)]]
  +
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
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**[[Oven 5 (Labline)]]
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**[[Vacuum Oven (YES)]]
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**[[High Temp Oven (Blue M)]]
  +
|
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|-
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|}
   
 
=Packaging=
 
=Packaging=
  +
* [[Flip-Chip Bonder]]
 
* [[Vacuum Sealer]]
+
*[[Dicing Saw (ADT)]]
  +
*[[Flip-Chip Bonder (Finetech)]]
* [[Dicing Saw]]
 
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*[[Vacuum Sealer]]
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*[[Wire Saw (Takatori)]]
   
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
  +
{|
* [[Field Emission SEM 1]]
 
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|- valign="top"
* [[Field Emission SEM 2]]
 
  +
| width="300" |
* [[Step Profile]]
 
  +
=====Optical Microscopy=====
* [[Step Profilometer]]
 
  +
* [[Ellipsometer]]
 
* [[Microscopes]]
+
*[[Microscopes|Optical Microscopes]]
  +
*[[Fluorescence Microscope (Olympus MX51)]]
* [[Probe Station & Curve Tracer]]
 
* [[Optical Film Thickness (Filmetrics)]]
+
*[[Deep UV Optical Microscope (Olympus)]]
* [[Scanning Probe Microscope]]
+
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  +
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
* [[Tencor Flexus Film Stress]]
 
  +
* [[Optical Film Thickness (Nanometric)]]
 
  +
===== Electron Microscopy =====
* [[SEM Sample Coater]]
 
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*[[Field Emission SEM 1 (FEI Sirion)]]
* [[Surface Analysis]]
 
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*[[Field Emission SEM 2 (JEOL 7600F)]]
* [[Photo-emission & IR Microscope]]
 
* [[Ellipsometer (Woollam)]]
+
*[[SEM Sample Coater (Hummer)]]
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* [[Goniometer]]
 
  +
=====Topographical Metrology=====
* [[4-Point Probe Resistivity Mapper]]
 
  +
  +
*[[Step Profilometer (KLA Tencor P-7)]]
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*[[Step Profilometer (Dektak 6M)]]
  +
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
  +
*[[Surface Analysis (KLA/Tencor Surfscan)]]
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**''Sub-micron Particle Counter''
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  +
| width="400" |
  +
=====Thin-Film/Material Analysis=====
  +
  +
====== Thickness + Optical Constants ======
  +
*[[Ellipsometer (Woollam)]]
  +
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
  +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
  +
*[[Optical Film Thickness (Nanometric)]]
  +
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
  +
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  +
  +
====== Other Properties ======
  +
*[[Film Stress (Tencor Flexus)]]
  +
*[[Photoluminescence PL Setup (Custom)]]
  +
  +
====== Electrical Analysis ======
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*[[Resistivity Mapper (CDE RESMAP)]]
  +
*[[Probe Station & Curve Tracer]]
  +
  +
=====Other Tools=====
  +
  +
*[[Goniometer]]
  +
**''Surface hydrophobicity''
  +
|-
  +
|}

Latest revision as of 10:48, 22 May 2020

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Other Properties
Electrical Analysis
Other Tools