Difference between revisions of "Tool List"

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(Wet Processing: link to Mechanical_Polisher_(Allied))
 
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__NOTOC__
 
__NOTOC__
 
=Lithography=
 
=Lithography=
  +
 
{|
 
{|
|-valign="top"
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|- valign="top"
|width=300|
+
| width="300" |
  +
=====Photoresists and Lithography Chemicals=====
* [[Suss Aligners (SUSS MJB-3)]]
 
  +
* [[IR Aligner (SUSS MJB-3 IR)]]
 
  +
*See the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
* [[DUV Flood Expsaad3 (Labline)]]
 
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
* [[Oven 4 (Fisher)]]
 
  +
* [[High Temp Oven (Blue M)]]
 
  +
=====Contact Aligners (Optical Exposure)=====
* [[Vacuum Oven (YES)]]
 
  +
* [[Holographic Lith/PL Setup (Custom)]]
 
  +
*[[Suss Aligners (SUSS MJB-3)]]
|width=400|
 
* [[Stepper 1 (GCA 6300)]]
+
*[[IR Aligner (SUSS MJB-3 IR)]]
* [[Stepper 2 (AutoStep 200)]]
+
*[[Contact Aligner (SUSS MA-6)]]
* [[Stepper 3 (ASML DUV)]]
+
*[[DUV Flood Expose]]
  +
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
 
  +
=====Direct-Write Lithography=====
* [[Nano-Imprint (Nanonex NX2000)]]
 
  +
* [[Contact Aligner (SUSS MA-6)]]
 
  +
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
  +
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
  +
*[[Focused Ion-Beam Lithography (Raith Velion)]]
  +
*[[Maskless Aligner (Heidelberg MLA150)]]
  +
  +
===== Other Patterning Systems =====
  +
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
  +
| width="400" |
  +
=====Steppers (Optical Exposure)=====
  +
  +
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
  +
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
  +
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
  +
  +
=====Thermal Processing for Photolithography=====
  +
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
  +
*[[Ovens 1, 2 & 3 (Labline)]]
  +
*[[Oven 4 (Fisher)]]
  +
*[[Oven 5 (Labline)]]
  +
*[[High Temp Oven (Blue M)]]
  +
*[[Vacuum Oven (YES)]]
  +
  +
=====Lithography Support=====
  +
  +
*The [https://wiki.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
  +
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
  +
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
|-
 
|-
 
|}
 
|}
   
= Vacuum Deposition =
+
=Vacuum Deposition=
   
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
| width="300" |
+
| width="300" |
  +
=====Physical Vapor Deposition (PVD)=====
*[[E-Beam 1 (Sharon)]]
 
*[[E-Beam 2 (Custom)]]
 
*[[E-Beam 3 (Temescal)]]
 
*[[E-Beam 4 (CHA)]]
 
*[[Sputter 1 (Custom)]]
 
*[[Sputter 2 (SFI Endeavor)]]
 
*[[Sputter 3 (AJA ATC 2000-F)]]
 
*[[Sputter 4 (AJA ATC 2200-V)]]
 
*[[Sputter 5 (Lesker AXXIS)]]
 
   
  +
*[[E-Beam 1 (Sharon)]]
| width="400" |
 
*[[PECVD 1 (PlasmaTherm 790)]]
+
*[[E-Beam 2 (Custom)]]
*[[PECVD 2 (Advanced Vacuum)]]
+
*[[E-Beam 3 (Temescal)]]
*[[Thermal Evap 1]]
+
*[[E-Beam 4 (CHA)]]
*[[Thermal Evap 2 (Solder)]]
+
*[[Thermal Evap 1]]
*[[ICP-PECVD (Unaxis VLR)]]
+
*[[Thermal Evap 2 (Solder)]]
  +
*[[Ion Beam Deposition (Veeco NEXUS)]]
 
*[[Molecular Vapor Deposition]]
+
=====Sputter Deposition=====
  +
*[[Atomic Layer Deposision (Oxford FlexAL)]]
 
  +
*[[Sputter 3 (AJA ATC 2000-F)]]
  +
*[[Sputter 4 (AJA ATC 2200-V)]]
  +
*[[Sputter 5 (AJA ATC 2200-V)]]
  +
*[[Ion Beam Deposition (Veeco NEXUS)]]
  +
  +
| width="400" |
  +
=====Chemical Vapor Deposition (CVD)=====
  +
  +
*[[PECVD 1 (PlasmaTherm 790)]]
  +
*[[PECVD 2 (Advanced Vacuum)]]
  +
*[[ICP-PECVD (Unaxis VLR)]]
  +
*[[Molecular Vapor Deposition]]
  +
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
   
 
|}
 
|}
   
= Dry Etch =
+
=Dry Etch=
   
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
| width="300" |
+
| width="300" |
  +
=====Reactive Ion Etching (RIE)=====
*[[RIE 1 (Custom)]]
 
  +
*[[RIE 2 (MRC)]]
 
*[[RIE 3 (MRC)]]
+
*[[RIE 2 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]
+
*[[RIE 3 (MRC)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
+
*[[RIE 5 (PlasmaTherm)]]
  +
*[[Ashers (Technics PEII)]]
 
  +
=====Plasma Etching and Cleaning=====
*[[UV Ozone Reactor]]
 
  +
| width="400" |
 
*[[ICP Etch 1 (Panasonic E626I)]]
+
*[[Plasma Clean (Gasonics 2000)]]
*[[ICP Etch 2 (Panasonic E640)]]
+
*[[Plasma Clean (YES EcoClean)]]
  +
*[[Plasma Activation (EVG 810)]]
  +
*[[Ashers (Technics PEII)]]
  +
  +
=====Etch Monitoring=====
  +
  +
*[[Laser Etch Monitoring]] (Endpoint Detection)
  +
*Optical Emission Spectra
  +
*Residual Gas Analyzer (RGA)
  +
| width="400" |
  +
=====ICP-RIE=====
  +
  +
*[[ICP Etch 1 (Panasonic E626I)]]
  +
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP-Etch (Unaxis VLR)]]
 
*[[ICP-Etch (Unaxis VLR)]]
  +
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[Plasma Clean (Gasonics 2000)]]
 
  +
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
 
  +
*[[Plasma Activation (EVG 810)]]
 
  +
=====Ion Milling and Reactive Ion Beam Etching=====
*[[HF Vapor Etch]]
 
  +
  +
*[[CAIBE (Oxford Ion Mill)]]
  +
  +
=====Other Dry Etching=====
  +
  +
*[[UV Ozone Reactor]]
  +
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
  +
*[[Vapor HF Etch]]
   
 
|}
 
|}
   
 
=Wet Processing=
 
=Wet Processing=
  +
See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc.
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
* [[Wet Benches]]
+
*[[Wet Benches]]
 
**[[Solvent Cleaning Benches]]
 
**[[Solvent Cleaning Benches]]
 
**[[Spin Coat Benches]]
 
**[[Spin Coat Benches]]
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**[[HF/TMAH Processing Benches]]
 
**[[HF/TMAH Processing Benches]]
 
**[[Plating Bench]]
 
**[[Plating Bench]]
|width=400|
+
| width="400" |
* [[Gold Plating Bench]]
+
*[[Gold Plating Bench]]
* [[Critical Point Dryer]]
+
*[[Critical Point Dryer]]
* [[Spin Rinse Dryer (SemiTool)]]
+
*[[Spin Rinse Dryer (SemiTool)]]
* [[Chemical-Mechanical Polisher (Logitech)]]
+
*[[Chemical-Mechanical Polisher (Logitech)]]
  +
*[[Mechanical Polisher (Allied)]]
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  +
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 
|-
 
|-
 
|}
 
|}
   
 
=Thermal Processing=
 
=Thermal Processing=
  +
{|
* [[Rapid Thermal Processor (AET RX6)]]
 
  +
|- valign="top"
* [[Strip Annealer]]
 
  +
| width="400" |
* [[Tube Furnace (Tystar 8300)]]
 
  +
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
 
  +
*[[Rapid Thermal Processor (SSI Solaris 150)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
 
  +
*[[Tube Furnace (Tystar 8300)]]
  +
*[[Tube Furnace Wafer Bonding (Thermco)]]
  +
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
  +
*[[Wafer Bonder (SUSS SB6-8E)]]
  +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
  +
| width="400" |
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
  +
**[[Ovens 1, 2 & 3 (Labline)]]
  +
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
  +
**[[Oven 5 (Labline)]]
  +
**[[Vacuum Oven (YES)]]
  +
**[[High Temp Oven (Blue M)]]
  +
|
  +
|-
  +
|}
   
 
=Packaging=
 
=Packaging=
  +
* [[Dicing Saw (ADT)]]
 
* [[Flip-Chip Bonder (Finetech)]]
+
*[[Dicing Saw (ADT)]]
  +
*[[Flip-Chip Bonder (Finetech)]]
* [[Vacuum Sealer]]
 
  +
*[[Vacuum Sealer]]
* [[Wafer Bonder (SUSS SB6-8E)]]
 
* [[Wire Saw (Takatori)]]
+
*[[Wire Saw (Takatori)]]
   
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
  +
=====Optical Microscopy=====
* [[Field Emission SEM 1 (FEI Sirion)]]
 
  +
* [[Field Emission SEM 2 (JEOL 7600F)]]
 
  +
*[[Microscopes|Optical Microscopes]]
* [[Step Profile (Dektak IIA)]]
 
* [[Step Profilometer (Dektak 6M)]]
+
*[[Fluorescence Microscope (Olympus MX51)]]
  +
*[[Deep UV Optical Microscope (Olympus)]]
* [[Ellipsometer (Rudolph)]]
 
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Microscopes]]
 
  +
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
* [[Probe Station & Curve Tracer]]
 
  +
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
* [[Optical Film Thickness (Filmetrics)]]
 
  +
* [[Optical Film Thickness (Nanometric)]]
 
  +
===== Electron Microscopy =====
* [[Goniometer]]
 
  +
*[[Field Emission SEM 1 (FEI Sirion)]]
|width=400|
 
* [[Film Stress (Tencor Flexus)]]
+
*[[Field Emission SEM 2 (JEOL 7600F)]]
* [[SEM Sample Coater (Hummer)]]
+
*[[SEM Sample Coater (Hummer)]]
  +
* [[Surface Analysis (KLA/Tencor Surfscan)]]
 
  +
=====Topographical Metrology=====
* [[Photo-emission & IR Microscope (QFI)]]
 
  +
* [[Ellipsometer (Woollam)]]
 
  +
*[[Step Profilometer (KLA Tencor P-7)]]
* [[Resistivity Mapper (CDE RESMAP)]]
 
  +
*[[Step Profilometer (Dektak 6M)]]
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
* [[Deep UV Optical Microscope (Olympus)]]
+
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
  +
*[[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Fluorescence Microscope (Olympus MX51)]]
 
  +
**''Sub-micron Particle Counter''
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
 
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  +
| width="400" |
  +
=====Thin-Film/Material Analysis=====
  +
  +
====== Thickness + Optical Constants ======
  +
*[[Ellipsometer (Woollam)]]
  +
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
  +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
  +
*[[Optical Film Thickness (Nanometric)]]
  +
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
  +
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  +
  +
====== Other Properties ======
  +
*[[Film Stress (Tencor Flexus)]]
  +
*[[Photoluminescence PL Setup (Custom)]]
  +
  +
====== Electrical Analysis ======
  +
*[[Resistivity Mapper (CDE RESMAP)]]
  +
*[[Probe Station & Curve Tracer]]
  +
  +
=====Other Tools=====
  +
  +
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
  +
**''Surface hydrophobicity''
  +
|-
  +
|
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|
 
|-
 
|-
 
|}
 
|}

Latest revision as of 11:38, 11 May 2021

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Other Properties
Electrical Analysis
Other Tools