Difference between revisions of "Tool List"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
Line 97: Line 97:
  
 
=Packaging=
 
=Packaging=
 +
* [[Dicing Saw (ADT)]]
 
* [[Flip-Chip Bonder (Finetech)]]
 
* [[Flip-Chip Bonder (Finetech)]]
 
* [[Vacuum Sealer]]
 
* [[Vacuum Sealer]]
* [[Dicing Saw (ADT)]]
+
* [[Wafer Bonder (SUSS SB6-8E)]]
 
* [[Wire Saw (Takatori)]]
 
* [[Wire Saw (Takatori)]]
* [[Wafer Bonder (SUSS SB6-8E)]]
 
  
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=

Revision as of 10:55, 11 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization