Difference between revisions of "Tool List"
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* [[Ovens 1, 2 & 3 (Labline)]] |
* [[Ovens 1, 2 & 3 (Labline)]] |
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* [[Oven 4 (Fisher)]] |
* [[Oven 4 (Fisher)]] |
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− | * [[ |
+ | * [[High Temp Oven (Blue M)]] |
* [[Vacuum Oven (YES)]] |
* [[Vacuum Oven (YES)]] |
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* [[Holographic Lith/PL Setup (Custom)]] |
* [[Holographic Lith/PL Setup (Custom)]] |
Revision as of 10:11, 11 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Dicing Saw (ADT)
- Wire Saw (Takatori)
- Wafer Bonder (SUSS SB6-8E)