Difference between revisions of "Tool List"
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| − | =Vacuum Deposition= |
+ | = Vacuum Deposition = |
| + | |||
{| |
{| |
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| − | |-valign="top" |
+ | |- valign="top" |
| − | |width=300| |
+ | | width="300" | |
| − | * |
+ | *[[E-Beam 1 (Sharon)]] |
| − | * |
+ | *[[E-Beam 2 (Custom)]] |
| − | * |
+ | *[[E-Beam 3 (Temescal)]] |
| − | * |
+ | *[[E-Beam 4 (CHA)]] |
| − | * |
+ | *[[Sputter 1 (Custom)]] |
| − | * |
+ | *[[Sputter 2 (SFI Endeavor)]] |
| − | * |
+ | *[[Sputter 3 (ATC 2000-F)]] |
| − | * |
+ | *[[Sputter 4 (ATC 2200-V)]] |
| − | * |
+ | *[[Sputter 5 (Lesker AXXIS)]] |
| + | |||
| − | |width=400| |
+ | | width="400" | |
| ⚫ | |||
| − | * |
+ | *[[PECVD 1 (PlasmaTherm 790)]] |
| ⚫ | |||
| − | * [[Thermal Evap 1]] |
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| − | * |
+ | *[[Thermal Evap 1]] |
| − | * |
+ | *[[Thermal Evap 2]] |
| + | *[[Unaxis VLR ICP-PECVD]] |
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| − | * [[Ion Beam Deposition (Veeco NEXUS)]] |
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| − | * |
+ | *[[Ion Beam Deposition (Veeco NEXUS)]] |
| + | *[[Molecular Vapor Deposition]] |
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| − | * |
+ | *[[Atomic Layer Deposision (Oxford FlexAL)]] |
| − | |- |
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| + | |||
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| Line 63: | Line 65: | ||
| width="400" | |
| width="400" | |
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| − | *[[ICP Etch 1 (Panasonic |
+ | *[[ICP Etch 1 (Panasonic E626I)]] |
| − | *[[ICP Etch 2 (Panasonic |
+ | *[[ICP Etch 2 (Panasonic E640)]] |
*[[UV Ozone Reactor]] |
*[[UV Ozone Reactor]] |
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*[[Plasma Clean (Gasonics 2000)]] |
*[[Plasma Clean (Gasonics 2000)]] |
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| Line 119: | Line 121: | ||
* [[Optical Film Thickness (Nanometric)]] |
* [[Optical Film Thickness (Nanometric)]] |
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* [[Scanning Probe Microscope (Veeco NanoMan)]] |
* [[Scanning Probe Microscope (Veeco NanoMan)]] |
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| + | * [[ Surfscan 6200]] |
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|width=400| |
|width=400| |
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* [[Tencor Flexus Film Stress]] |
* [[Tencor Flexus Film Stress]] |
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Revision as of 07:17, 10 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)