Difference between revisions of "Tool List"
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{| |
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+ | |width=300| |
* [[E-Beam 1 (Sharon)]] |
* [[E-Beam 1 (Sharon)]] |
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* [[E-Beam 2 (Custom)]] |
* [[E-Beam 2 (Custom)]] |
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* [[Sputter 1 (Custom)]] |
* [[Sputter 1 (Custom)]] |
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* [[Sputter 2 (SFI Endeavor)]] |
* [[Sputter 2 (SFI Endeavor)]] |
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| − | * [[Sputter 3]] |
+ | * [[Sputter 3 (AJA)]] |
| − | * [[Sputter 4]] |
+ | * [[Sputter 4 (AJA)]] |
| ⚫ | |||
* [[Sputter 5 (Lesker AXXIS)]] |
* [[Sputter 5 (Lesker AXXIS)]] |
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| ⚫ | |||
| − | * [[PECVD 1]] |
+ | * [[PECVD 1 (PlasmTherm 790)]] |
* [[PECVD 2 (Advanced Vacuum)]] |
* [[PECVD 2 (Advanced Vacuum)]] |
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| + | * [[Thermal Evap 1]] |
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| + | * [[Thermal Evap 2]] |
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* [[Unaxis VLR ICP-PECVD]] |
* [[Unaxis VLR ICP-PECVD]] |
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| + | * [[Ion Beam Deposition (Veeco NEXUS)]] |
||
| − | * [[IBD]] |
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* [[Molecular Vapor Deposition]] |
* [[Molecular Vapor Deposition]] |
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* [[Atomic Layer Deposision (Oxford Flexal)]] |
* [[Atomic Layer Deposision (Oxford Flexal)]] |
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Revision as of 12:47, 28 June 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
Inspection, Test and Characterization
- Field Emission SEM 1
- Field Emission SEM 2
- Step Profile
- Step Profilometer
- Ellipsometer
- Microscopes
- Probe Station & Curve Tracer
- Optical Film Thickness (Filmetrics)
- Scanning Probe Microscope
- Tencor Flexus Film Stress
- Optical Film Thickness (Nanometric)
- SEM Sample Coater
- Surface Analysis
- Photo-emission & IR Microscope
- Ellipsometer (Woollam)
- Goniometer
- 4-Point Probe Resistivity Mapper