Difference between revisions of "Tool List"
Jump to navigation
Jump to search
(→Wet Processing: link to Wafer_Toxic_Corrosive_Bench) |
|||
(2 intermediate revisions by 2 users not shown) | |||
Line 40: | Line 40: | ||
*[[Oven 5 (Labline)]] |
*[[Oven 5 (Labline)]] |
||
*[[High Temp Oven (Blue M)]] |
*[[High Temp Oven (Blue M)]] |
||
− | *[[Vacuum Oven (YES)]] |
||
=====Lithography Support===== |
=====Lithography Support===== |
||
Line 140: | Line 139: | ||
**[[Develop Benches]] |
**[[Develop Benches]] |
||
**[[Toxic Corrosive Benches]] |
**[[Toxic Corrosive Benches]] |
||
+ | **[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]] |
||
**[[HF/TMAH Processing Benches]] |
**[[HF/TMAH Processing Benches]] |
||
**[[Plating Bench]] |
**[[Plating Bench]] |
||
Line 203: | Line 203: | ||
*[[Deep UV Optical Microscope (Olympus)]] |
*[[Deep UV Optical Microscope (Olympus)]] |
||
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
||
⚫ | |||
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
||
Line 232: | Line 231: | ||
*[[Resistivity Mapper (CDE RESMAP)]] |
*[[Resistivity Mapper (CDE RESMAP)]] |
||
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
||
⚫ | |||
======Other Properties====== |
======Other Properties====== |
Revision as of 22:52, 1 October 2022
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and CleaningEtch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical Analysis
Other Properties |