Difference between revisions of "Tool List"
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(→Packaging: fixed FLip-scribe link) |
(→Wet Processing: link to Wafer_Toxic_Corrosive_Bench) |
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*[[Oven 5 (Labline)]] |
*[[Oven 5 (Labline)]] |
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*[[High Temp Oven (Blue M)]] |
*[[High Temp Oven (Blue M)]] |
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| − | *[[Vacuum Oven (YES)]] |
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=====Lithography Support===== |
=====Lithography Support===== |
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| Line 55: | Line 54: | ||
|- valign="top" |
|- valign="top" |
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| width="300" | |
| width="300" | |
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| − | + | ====Physical Vapor Deposition (PVD)==== |
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| + | |||
| + | =====Thermal Evaporation===== |
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*[[E-Beam 1 (Sharon)]] |
*[[E-Beam 1 (Sharon)]] |
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| Line 70: | Line 71: | ||
*[[Sputter 5 (AJA ATC 2200-V)]] |
*[[Sputter 5 (AJA ATC 2200-V)]] |
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*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
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| + | *[[SEM Sample Coater (Hummer)]] |
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| width="400" | |
| width="400" | |
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| Line 95: | Line 97: | ||
=====Plasma Etching and Cleaning===== |
=====Plasma Etching and Cleaning===== |
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| − | *[[Plasma Clean (Gasonics 2000)]] |
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*[[Plasma Clean (YES EcoClean)]] |
*[[Plasma Clean (YES EcoClean)]] |
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*[[Plasma Activation (EVG 810)]] |
*[[Plasma Activation (EVG 810)]] |
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| Line 118: | Line 119: | ||
*[[CAIBE (Oxford Ion Mill)]] |
*[[CAIBE (Oxford Ion Mill)]] |
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| + | *[[Focused Ion-Beam Lithography (Raith Velion)]] |
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=====Other Dry Etching===== |
=====Other Dry Etching===== |
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| Line 137: | Line 139: | ||
**[[Develop Benches]] |
**[[Develop Benches]] |
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**[[Toxic Corrosive Benches]] |
**[[Toxic Corrosive Benches]] |
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| + | **[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]] |
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**[[HF/TMAH Processing Benches]] |
**[[HF/TMAH Processing Benches]] |
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**[[Plating Bench]] |
**[[Plating Bench]] |
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| Line 166: | Line 169: | ||
**[[Oven 4 (Thermo-Fisher HeraTherm)]] |
**[[Oven 4 (Thermo-Fisher HeraTherm)]] |
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**[[Oven 5 (Labline)]] |
**[[Oven 5 (Labline)]] |
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| − | **[[Vacuum Oven (YES)]] |
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**[[High Temp Oven (Blue M)]] |
**[[High Temp Oven (Blue M)]] |
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|- |
|- |
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| Line 201: | Line 203: | ||
*[[Deep UV Optical Microscope (Olympus)]] |
*[[Deep UV Optical Microscope (Olympus)]] |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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| ⚫ | |||
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
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| Line 222: | Line 223: | ||
*[[Ellipsometer (Woollam)]] |
*[[Ellipsometer (Woollam)]] |
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| − | *[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]] |
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*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
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| − | *[[Optical Film Thickness (Nanometric)]] |
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*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
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*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
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| Line 232: | Line 231: | ||
*[[Resistivity Mapper (CDE RESMAP)]] |
*[[Resistivity Mapper (CDE RESMAP)]] |
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*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
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| ⚫ | |||
======Other Properties====== |
======Other Properties====== |
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Revision as of 22:52, 1 October 2022
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and CleaningEtch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical Analysis
Other Properties |