Difference between revisions of "Tool List"
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(→Thickness + Optical Constants: Deleted Nanometrics (removed from lab)) |
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*[[Oven 5 (Labline)]] |
*[[Oven 5 (Labline)]] |
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*[[High Temp Oven (Blue M)]] |
*[[High Temp Oven (Blue M)]] |
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− | *[[Vacuum Oven (YES)]] |
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=====Lithography Support===== |
=====Lithography Support===== |
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|- valign="top" |
|- valign="top" |
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| width="300" | |
| width="300" | |
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− | + | ====Physical Vapor Deposition (PVD)==== |
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+ | |||
+ | =====Thermal Evaporation===== |
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*[[E-Beam 1 (Sharon)]] |
*[[E-Beam 1 (Sharon)]] |
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*[[Sputter 5 (AJA ATC 2200-V)]] |
*[[Sputter 5 (AJA ATC 2200-V)]] |
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*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
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+ | *[[SEM Sample Coater (Hummer)]] |
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| width="400" | |
| width="400" | |
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=====Plasma Etching and Cleaning===== |
=====Plasma Etching and Cleaning===== |
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− | *[[Plasma Clean (Gasonics 2000)]] |
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*[[Plasma Clean (YES EcoClean)]] |
*[[Plasma Clean (YES EcoClean)]] |
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*[[Plasma Activation (EVG 810)]] |
*[[Plasma Activation (EVG 810)]] |
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**[[Oven 4 (Thermo-Fisher HeraTherm)]] |
**[[Oven 4 (Thermo-Fisher HeraTherm)]] |
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**[[Oven 5 (Labline)]] |
**[[Oven 5 (Labline)]] |
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− | **[[Vacuum Oven (YES)]] |
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**[[High Temp Oven (Blue M)]] |
**[[High Temp Oven (Blue M)]] |
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|- |
|- |
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*[[Deep UV Optical Microscope (Olympus)]] |
*[[Deep UV Optical Microscope (Olympus)]] |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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⚫ | |||
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
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*[[Resistivity Mapper (CDE RESMAP)]] |
*[[Resistivity Mapper (CDE RESMAP)]] |
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*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
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⚫ | |||
======Other Properties====== |
======Other Properties====== |
Revision as of 14:17, 2 September 2022
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and CleaningEtch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical Analysis
Other Properties |