Revision as of 14:17, 2 September 2022

Lithography

Photoresists and Lithography Chemicals

See the Chemical Datasheets page.
Auto. Coat/Develop (S-Cubed Flexi)

Contact Aligners (Optical Exposure)

Direct-Write Lithography

Other Patterning Systems

Holographic Litho/PL Setup (Custom)

Steppers (Optical Exposure)

Thermal Processing for Photolithography

Lithography Support

The Spinner Benches have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
POLOS spinners on Develop and Solvent benches
Spin/Rinse/Dryer

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation

Sputter Deposition

Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)

Plasma Etching and Cleaning

Etch Monitoring

Laser Etch Monitoring (Endpoint Detection)
Optical Emission Spectra
Residual Gas Analyzer (RGA)

ICP-RIE

Ion Milling and Reactive Ion Beam Etching

Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Wet Benches

Thermal Processing

Ovens - Overview of all Lab Ovens

Packaging

Die Singulation / Down-sizing

Other Packaging

Vacuum Sealer

Wafer/Die Bonding

Flip-Chip Bonder (Finetech)

Inspection, Test and Characterization

Optical Microscopy

Electron Microscopy

Topographical Metrology

Thin-Film/Material Analysis

Thickness + Optical Constants

Electrical Analysis

Other Properties

Film Stress (Tencor Flexus)
Particle Counts (KLA/Tencor Surfscan)
Photoluminescence PL Setup (Custom)
Goniometer (Ramé-Hart A-100)
- Surface hydrophobicity

@@ Line 40: / Line 40: @@
 *[[Oven 5 (Labline)]]
 *[[High Temp Oven (Blue M)]]
-*[[Vacuum Oven (YES)]]
 =====Lithography Support=====
@@ Line 55: / Line 54: @@
 |- valign="top"
 | width="300" |
-=====Physical Vapor Deposition (PVD)=====
+====Physical Vapor Deposition (PVD)====
+=====Thermal Evaporation=====
 *[[E-Beam 1 (Sharon)]]
@@ Line 70: / Line 71: @@
 *[[Sputter 5 (AJA ATC 2200-V)]]
 *[[Ion Beam Deposition (Veeco NEXUS)]]
+*[[SEM Sample Coater (Hummer)]]
 | width="400" |
@@ Line 95: / Line 97: @@
 =====Plasma Etching and Cleaning=====
-*[[Plasma Clean (Gasonics 2000)]]
 *[[Plasma Clean (YES EcoClean)]]
 *[[Plasma Activation (EVG 810)]]
@@ Line 118: / Line 119: @@
 *[[CAIBE (Oxford Ion Mill)]]
+*[[Focused Ion-Beam Lithography (Raith Velion)]]
 =====Other Dry Etching=====
@@ Line 166: / Line 168: @@
 **[[Oven 4 (Thermo-Fisher HeraTherm)]]
 **[[Oven 5 (Labline)]]
-**[[Vacuum Oven (YES)]]
 **[[High Temp Oven (Blue M)]]
-|
 |-
 |}
 =Packaging=
+{|
+|
+====Die Singulation / Down-sizing====
 *[[Dicing Saw (ADT)]]
+*[[Wafer Cleaver (PELCO Flip-Scribe)|Wafer Cleaver (PELCO Flipscribe)]]
-*[[Flip-Chip Bonder (Finetech)]]
+====Other Packaging====
 *[[Vacuum Sealer]]
+|
+====Wafer/Die Bonding====
+*[[Flip-Chip Bonder (Finetech)]]
+*[[Wafer Bonder (SUSS SB6-8E)]]
+*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
+|}
 =Inspection, Test and Characterization=
@@ Line 184: / Line 198: @@
 =====Optical Microscopy=====
-*[[Microscopes|Optical Microscopes]]
+*[[Microscopes|Optical Microscopes]] - ''General Use''
 *[[Fluorescence Microscope (Olympus MX51)]]
 *[[Deep UV Optical Microscope (Olympus)]]
 *[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
-*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
 *[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
@@ Line 202: / Line 215: @@
 *[[Step Profilometer (Dektak 6M)]]
 *[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
-*[[Surface Analysis (KLA/Tencor Surfscan)]]
-**''Sub-micron Particle Counter''
 *[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 | width="400" |
@@ Line 211: / Line 222: @@
 *[[Ellipsometer (Woollam)]]
-*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
 *[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
-*[[Optical Film Thickness (Nanometric)]]
 *[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 *[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
-======Other Properties======
-*[[Film Stress (Tencor Flexus)]]
-*[[Photoluminescence PL Setup (Custom)]]
 ======Electrical Analysis======
 *[[Resistivity Mapper (CDE RESMAP)]]
-*[[Probe Station & Curve Tracer]]
+*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
+*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
-=====Other Tools=====
+======Other Properties======
+*[[Film Stress (Tencor Flexus)]]
+*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
+*[[Photoluminescence PL Setup (Custom)]]
 *[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
 **''Surface hydrophobicity''
-|-
-|
-|
 |-
 |}

Difference between revisions of "Tool List"

Revision as of 14:17, 2 September 2022

Lithography

Photoresists and Lithography Chemicals

Contact Aligners (Optical Exposure)

Direct-Write Lithography

Other Patterning Systems

Steppers (Optical Exposure)

Thermal Processing for Photolithography

Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation

Sputter Deposition

Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)

Plasma Etching and Cleaning

Etch Monitoring

ICP-RIE

Ion Milling and Reactive Ion Beam Etching

Other Dry Etching

Wet Processing

Thermal Processing

Packaging

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Inspection, Test and Characterization

Optical Microscopy

Electron Microscopy

Topographical Metrology

Thin-Film/Material Analysis

Thickness + Optical Constants

Electrical Analysis

Other Properties

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