Difference between revisions of "Tool List"
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(→Inspection, Test and Characterization: Link to Olympus DSX1000 page) |
(→Inspection, Test and Characterization: rearranged, moved "other properties" to end, renamed "Surfscan" to "particle counts") |
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=====Photoresists and Lithography Chemicals===== |
=====Photoresists and Lithography Chemicals===== |
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− | *See the [https://wiki.nanotech.ucsb.edu/ |
+ | *See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page]. |
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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*[[Suss Aligners (SUSS MJB-3)]] |
*[[Suss Aligners (SUSS MJB-3)]] |
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− | *[[IR Aligner (SUSS MJB-3 IR)]] |
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*[[Contact Aligner (SUSS MA-6)]] |
*[[Contact Aligner (SUSS MA-6)]] |
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*[[DUV Flood Expose]] |
*[[DUV Flood Expose]] |
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*[[Maskless Aligner (Heidelberg MLA150)]] |
*[[Maskless Aligner (Heidelberg MLA150)]] |
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− | ===== |
+ | =====Other Patterning Systems===== |
+ | |||
− | *[[Nano-Imprint (Nanonex NX2000)]] |
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*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
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| width="400" | |
| width="400" | |
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=====Lithography Support===== |
=====Lithography Support===== |
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− | *The [https://wiki.nanotech.ucsb.edu/ |
+ | *The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes. |
− | *[https://signupmonkey.ece.ucsb.edu/ |
+ | *[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches |
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]] |
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]] |
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*[[ICP Etch 2 (Panasonic E640)]] |
*[[ICP Etch 2 (Panasonic E640)]] |
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*[[ICP-Etch (Unaxis VLR)]] |
*[[ICP-Etch (Unaxis VLR)]] |
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+ | *[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]] |
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*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
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*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
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*[[Spin Rinse Dryer (SemiTool)]] |
*[[Spin Rinse Dryer (SemiTool)]] |
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*[[Chemical-Mechanical Polisher (Logitech)]] |
*[[Chemical-Mechanical Polisher (Logitech)]] |
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+ | *[[Mechanical Polisher (Allied)]] |
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*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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− | *[https://signupmonkey.ece.ucsb.edu/ |
+ | *[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)] |
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*[[Flip-Chip Bonder (Finetech)]] |
*[[Flip-Chip Bonder (Finetech)]] |
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*[[Vacuum Sealer]] |
*[[Vacuum Sealer]] |
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− | *[[Wire Saw (Takatori)]] |
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=Inspection, Test and Characterization= |
=Inspection, Test and Characterization= |
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=====Optical Microscopy===== |
=====Optical Microscopy===== |
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− | *[[Microscopes|Optical Microscopes]] |
+ | *[[Microscopes|Optical Microscopes]] - ''General Use'' |
*[[Fluorescence Microscope (Olympus MX51)]] |
*[[Fluorescence Microscope (Olympus MX51)]] |
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*[[Deep UV Optical Microscope (Olympus)]] |
*[[Deep UV Optical Microscope (Olympus)]] |
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*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
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− | ===== |
+ | =====Electron Microscopy===== |
+ | |||
*[[Field Emission SEM 1 (FEI Sirion)]] |
*[[Field Emission SEM 1 (FEI Sirion)]] |
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*[[Field Emission SEM 2 (JEOL 7600F)]] |
*[[Field Emission SEM 2 (JEOL 7600F)]] |
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*[[Step Profilometer (Dektak 6M)]] |
*[[Step Profilometer (Dektak 6M)]] |
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*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]] |
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]] |
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⚫ | |||
− | **''Sub-micron Particle Counter'' |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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| width="400" | |
| width="400" | |
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=====Thin-Film/Material Analysis===== |
=====Thin-Film/Material Analysis===== |
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− | ====== |
+ | ======Thickness + Optical Constants====== |
+ | |||
*[[Ellipsometer (Woollam)]] |
*[[Ellipsometer (Woollam)]] |
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*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]] |
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]] |
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*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
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− | ====== |
+ | ======Electrical Analysis====== |
⚫ | |||
⚫ | |||
− | ====== Electrical Analysis ====== |
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*[[Resistivity Mapper (CDE RESMAP)]] |
*[[Resistivity Mapper (CDE RESMAP)]] |
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− | *[[Probe Station & Curve Tracer]] |
+ | *[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
− | =====Other |
+ | ====== Other Properties ====== |
⚫ | |||
⚫ | |||
⚫ | |||
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]] |
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]] |
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**''Surface hydrophobicity'' |
**''Surface hydrophobicity'' |
Revision as of 11:29, 4 January 2022
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and Cleaning
Etch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical AnalysisOther Properties |