Difference between revisions of "Tool List"

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(→‎Inspection, Test and Characterization: deleted Filmetrics Profilm3D link)
(→‎Inspection, Test and Characterization: rearranged, moved "other properties" to end, renamed "Surfscan" to "particle counts")
(27 intermediate revisions by 6 users not shown)
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=====Photoresists and Lithography Chemicals=====
  
=====Photoresists and Lithography Chemicals=====
   
−
*See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
 +
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
   
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*[[Suss Aligners (SUSS MJB-3)]]
  
*[[Suss Aligners (SUSS MJB-3)]]
−
*[[IR Aligner (SUSS MJB-3 IR)]]
  
 
*[[Contact Aligner (SUSS MA-6)]]
  
*[[Contact Aligner (SUSS MA-6)]]
 
*[[DUV Flood Expose]]
  
*[[DUV Flood Expose]]
   
−
=====Other Patterning Systems=====
 +
=====Direct-Write Lithography=====
   
 
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
  
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
  +
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
−
*[[Nano-Imprint (Nanonex NX2000)]]
  
  +
*[[Focused Ion-Beam Lithography (Raith Velion)]]
  +
*[[Maskless Aligner (Heidelberg MLA150)]]
  +
  +
=====Other Patterning Systems=====
  +
 
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
  
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 
| width="400" |
  
| width="400" |
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=====Lithography Support=====
  
=====Lithography Support=====
   
−
*The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
 +
*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
−
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
 +
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
 
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
  
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
|-
  
|-
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*[[ICP Etch 2 (Panasonic E640)]]
  
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP-Etch (Unaxis VLR)]]
  
*[[ICP-Etch (Unaxis VLR)]]
  +
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
 
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
  
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
 
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
  
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
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*[[Spin Rinse Dryer (SemiTool)]]
  
*[[Spin Rinse Dryer (SemiTool)]]
 
*[[Chemical-Mechanical Polisher (Logitech)]]
  
*[[Chemical-Mechanical Polisher (Logitech)]]
  +
*[[Mechanical Polisher (Allied)]]
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
−
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 +
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 
|-
  
|-
 
|}
  
|}
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**[[Vacuum Oven (YES)]]
  
**[[Vacuum Oven (YES)]]
 
**[[High Temp Oven (Blue M)]]
  
**[[High Temp Oven (Blue M)]]
  +
|
 
|-
  
|-
 
|}
  
|}
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*[[Flip-Chip Bonder (Finetech)]]
  
*[[Flip-Chip Bonder (Finetech)]]
 
*[[Vacuum Sealer]]
  
*[[Vacuum Sealer]]
−
*[[Wire Saw (Takatori)]]
  
   
 
=Inspection, Test and Characterization=
  
=Inspection, Test and Characterization=
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|- valign="top"
  
|- valign="top"
 
| width="300" |
  
| width="300" |
−
=====Optical/Electron Microscopy=====
 +
=====Optical Microscopy=====
   
−
*[[Microscopes|Optical Microscopes]]
 +
*[[Microscopes|Optical Microscopes]] - ''General Use''
 
*[[Fluorescence Microscope (Olympus MX51)]]
  
*[[Fluorescence Microscope (Olympus MX51)]]
 
*[[Deep UV Optical Microscope (Olympus)]]
  
*[[Deep UV Optical Microscope (Olympus)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
  
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
  +
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
  +
  +
=====Electron Microscopy=====
  +
 
*[[Field Emission SEM 1 (FEI Sirion)]]
  
*[[Field Emission SEM 1 (FEI Sirion)]]
 
*[[Field Emission SEM 2 (JEOL 7600F)]]
  
*[[Field Emission SEM 2 (JEOL 7600F)]]
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*[[Step Profilometer (Dektak 6M)]]
  
*[[Step Profilometer (Dektak 6M)]]
 
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
  
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
⚫
*[[Surface Analysis (KLA/Tencor Surfscan)]]
  
−
**''Sub-micron Particle Counter''
  
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
| width="400" |
  
| width="400" |
−
=====Thin-Film Analysis/Measurement=====
 +
=====Thin-Film/Material Analysis=====
  +
  +
======Thickness + Optical Constants======
   
 
*[[Ellipsometer (Woollam)]]
  
*[[Ellipsometer (Woollam)]]
−
*[[Film Stress (Tencor Flexus)]]
  
⚫
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
  
 
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
  
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
  ⚫
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
  ⚫
*[[Optical Film Thickness (Nanometric)]]
 
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
  
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  +
⚫
*[[Optical Film Thickness (Nanometric)]]
  
  +
======Electrical Analysis======
  +
 
*[[Resistivity Mapper (CDE RESMAP)]]
  
*[[Resistivity Mapper (CDE RESMAP)]]
  +
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
   
−
=====Other Tools=====
 +
====== Other Properties ======
   
−
*[[Probe Station & Curve Tracer]]
 +
*[[Film Stress (Tencor Flexus)]]
  ⚫
*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
−
*[[Goniometer]]
  
 
*[[Photoluminescence PL Setup (Custom)]]
  
*[[Photoluminescence PL Setup (Custom)]]
  +
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
  +
**''Surface hydrophobicity''
  +
|-
  +
|
  +
|
 
|-
  
|-
 
|}
  
|}

Revision as of 11:29, 4 January 2022

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Tool_List&oldid=159536"