Difference between revisions of "Tool List"

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__NOTOC__
 
__NOTOC__
 
=Lithography=
 
=Lithography=
 +
 
{|
 
{|
|-valign="top"
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|- valign="top"
|width=300|
+
| width="300" |
* [[Suss Aligners (SUSS MJB-3)]]
+
=====Photoresists and Lithography Chemicals=====
* [[IR Aligner (SUSS MJB-3 IR)]]
+
 
* [[DUV Flood Expose]]
+
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
* [[Ovens 1, 2 & 3 (Labline)]]
+
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
* [[Oven 4 (Fisher)]]
+
 
* [[Oven 5 (Blue M)]]
+
=====Contact Aligners (Optical Exposure)=====
* [[Vacuum Oven (YES)]]
+
 
* [[Holographic Lith/PL Setup (Custom)]]
+
*[[Suss Aligners (SUSS MJB-3)]]
|width=400|
+
*[[IR Aligner (SUSS MJB-3 IR)]]
* [[Stepper 1 (GCA 6300)]]
+
*[[Contact Aligner (SUSS MA-6)]]
* [[Stepper 2 (AutoStep 200)]]
+
*[[DUV Flood Expose]]
* [[Stepper 3 (ASML)]]
+
 
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
+
=====Direct-Write Lithography=====
* [[Nano-Imprint Tool (Nanonex NX2000)]]
+
 
* [[Contact Aligner (SUSS MA-6)]]
+
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
* [[Wafer Bonder (SUSS SB6-8E)]]
+
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
 +
*[[Focused Ion-Beam Lithography (Raith Velion)]]
 +
*[[Maskless Aligner (Heidelberg MLA150)]]
 +
 
 +
=====Other Patterning Systems=====
 +
 
 +
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 +
| width="400" |
 +
=====Steppers (Optical Exposure)=====
 +
 
 +
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
 +
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
 +
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
 +
 
 +
=====Thermal Processing for Photolithography=====
 +
 
 +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
 +
*[[Ovens 1, 2 & 3 (Labline)]]
 +
*[[Oven 4 (Fisher)]]
 +
*[[Oven 5 (Labline)]]
 +
*[[High Temp Oven (Blue M)]]
 +
*[[Vacuum Oven (YES)]]
 +
 
 +
=====Lithography Support=====
 +
 
 +
*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
 +
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
 +
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
|-
 
|-
 
|}
 
|}
  
= Vacuum Deposition =
+
=Vacuum Deposition=
  
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
| width="300" |  
+
| width="300" |
*[[E-Beam 1 (Sharon)]]  
+
=====Physical Vapor Deposition (PVD)=====
*[[E-Beam 2 (Custom)]]  
+
 
*[[E-Beam 3 (Temescal)]]  
+
*[[E-Beam 1 (Sharon)]]
*[[E-Beam 4 (CHA)]]  
+
*[[E-Beam 2 (Custom)]]
*[[Sputter 1 (Custom)]]  
+
*[[E-Beam 3 (Temescal)]]
*[[Sputter 2 (SFI Endeavor)]]  
+
*[[E-Beam 4 (CHA)]]
*[[Sputter 3 (ATC 2000-F)]]  
+
*[[Thermal Evap 1]]
*[[Sputter 4 (ATC 2200-V)]]  
+
*[[Thermal Evap 2 (Solder)]]
*[[Sputter 5 (Lesker AXXIS)]]
+
 
 +
=====Sputter Deposition=====
 +
 
 +
*[[Sputter 3 (AJA ATC 2000-F)]]
 +
*[[Sputter 4 (AJA ATC 2200-V)]]
 +
*[[Sputter 5 (AJA ATC 2200-V)]]
 +
*[[Ion Beam Deposition (Veeco NEXUS)]]
 +
 
 +
| width="400" |
 +
=====Chemical Vapor Deposition (CVD)=====
  
| width="400" |
+
*[[PECVD 1 (PlasmaTherm 790)]]
*[[PECVD 1 (PlasmaTherm 790)]]  
+
*[[PECVD 2 (Advanced Vacuum)]]
*[[PECVD 2 (Advanced Vacuum)]]  
+
*[[ICP-PECVD (Unaxis VLR)]]
*[[Thermal Evap 1]]
+
*[[Molecular Vapor Deposition]]
*[[Thermal Evap 2 (Solder)]]
+
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
*[[Unaxis VLR ICP-PECVD]]
 
*[[Ion Beam Deposition (Veeco NEXUS)]]  
 
*[[Molecular Vapor Deposition]]  
 
*[[Atomic Layer Deposision (Oxford FlexAL)]]
 
  
 
|}
 
|}
  
= Dry Etch =
+
=Dry Etch=
  
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
| width="300" |  
+
| width="300" |
*[[RIE 1 (Custom)]]  
+
=====Reactive Ion Etching (RIE)=====
*[[RIE 2 (MRC)]]  
+
 
*[[RIE 3 (MRC)]]  
+
*[[RIE 2 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]  
+
*[[RIE 3 (MRC)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]  
+
*[[RIE 5 (PlasmaTherm)]]
*[[Ashers (Technics PEII)]]  
+
 
*[[Unaxis VLR ICP-Etch]]
+
=====Plasma Etching and Cleaning=====
 +
 
 +
*[[Plasma Clean (Gasonics 2000)]]
 +
*[[Plasma Clean (YES EcoClean)]]
 +
*[[Plasma Activation (EVG 810)]]
 +
*[[Ashers (Technics PEII)]]
 +
 
 +
=====Etch Monitoring=====
 +
 
 +
*[[Laser Etch Monitoring]] (Endpoint Detection)
 +
*Optical Emission Spectra
 +
*Residual Gas Analyzer (RGA)
 +
| width="400" |
 +
=====ICP-RIE=====
 +
 
 +
*[[ICP Etch 1 (Panasonic E626I)]]
 +
*[[ICP Etch 2 (Panasonic E640)]]
 +
*[[ICP-Etch (Unaxis VLR)]]
 +
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
 +
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
 +
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
 +
 
 +
=====Ion Milling and Reactive Ion Beam Etching=====
 +
 
 +
*[[CAIBE (Oxford Ion Mill)]]
 +
 
 +
=====Other Dry Etching=====
  
| width="400" |
+
*[[UV Ozone Reactor]]
*[[ICP Etch 1 (Panasonic E626I)]]
+
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
*[[ICP Etch 2 (Panasonic E640)]]
+
*[[Vapor HF Etch]]
*[[UV Ozone Reactor]]
 
*[[Plasma Clean (Gasonics 2000)]]  
 
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]  
 
*[[Plasma Activation (EVG 810)]]
 
*[[HF Vapor Etch]]
 
  
 
|}
 
|}
  
 
=Wet Processing=
 
=Wet Processing=
 +
See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc.
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
* [[Gold Plating Bench]]
+
*[[Wet Benches]]
* [[Critical Point Dryer]]
+
**[[Solvent Cleaning Benches]]
* [[Spin Rinse Dryer (SemiTool)]]
+
**[[Spin Coat Benches]]
* [[Chemical-Mechanical Polisher (Logitech)]]
+
**[[Develop Benches]]
|width=400|
+
**[[Toxic Corrosive Benches]]
* Wet Benches
+
**[[HF/TMAH Processing Benches]]
**[[Acid Benches]]
+
**[[Plating Bench]]
**[[Solvent Benches]]
+
| width="400" |
**[[Photoresist Spin Coat Benches]]
+
*[[Gold Plating Bench]]
**[[Develop Wet Benches]]
+
*[[Critical Point Dryer]]
 +
*[[Spin Rinse Dryer (SemiTool)]]
 +
*[[Chemical-Mechanical Polisher (Logitech)]]
 +
*[[Mechanical Polisher (Allied)]]
 +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 +
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 
|-
 
|-
 
|}
 
|}
  
 
=Thermal Processing=
 
=Thermal Processing=
* [[Rapid Thermal Processor (AET RX6)]]
+
{|
* [[Strip Annealer]]
+
|- valign="top"
* [[Tube Furnace (Tystar 8300)]]
+
| width="400" |
* [[Tube Furnace Wafer Bonding (Thermco)]]
+
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
+
*[[Rapid Thermal Processor (SSI Solaris 150)]]
 +
*[[Tube Furnace (Tystar 8300)]]
 +
*[[Tube Furnace Wafer Bonding (Thermco)]]
 +
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
 +
*[[Wafer Bonder (SUSS SB6-8E)]]
 +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
 +
| width="400" |
 +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
 +
**[[Ovens 1, 2 & 3 (Labline)]]
 +
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
 +
**[[Oven 5 (Labline)]]
 +
**[[Vacuum Oven (YES)]]
 +
**[[High Temp Oven (Blue M)]]
 +
|
 +
|-
 +
|}
  
 
=Packaging=
 
=Packaging=
* [[Flip-Chip Bonder (Finetech)]]
+
 
* [[Vacuum Sealer]]
+
*[[Dicing Saw (ADT)]]
* [[Dicing Saw (ADT)]]
+
*[[Flip-Chip Bonder (Finetech)]]
* [[Wire Saw (Takatori)]]
+
*[[Vacuum Sealer]]
 +
*[[Wire Saw (Takatori)]]
  
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
* [[Field Emission SEM 1 (FEI Sirion)]]
+
=====Optical Microscopy=====
* [[Field Emission SEM 2 (JEOL 7600F)]]
+
 
* [[Step Profile (Dektak IIA)]]
+
*[[Microscopes|Optical Microscopes]]
* [[Step Profilometer (Dektak 6M)]]
+
*[[Fluorescence Microscope (Olympus MX51)]]
* [[Ellipsometer (Rudolph)]]
+
*[[Deep UV Optical Microscope (Olympus)]]
* [[Microscopes]]
+
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Probe Station & Curve Tracer]]
+
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
* [[Optical Film Thickness (Filmetrics)]]
+
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
* [[Optical Film Thickness (Nanometric)]]
+
 
* [[Goniometer]]
+
=====Electron Microscopy=====
|width=400|
+
 
* [[Tencor Flexus Film Stress]]
+
*[[Field Emission SEM 1 (FEI Sirion)]]
* [[SEM Sample Coater (Hummer)]]
+
*[[Field Emission SEM 2 (JEOL 7600F)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
+
*[[SEM Sample Coater (Hummer)]]
* [[Photo-emission & IR Microscope (QFI)]]
+
 
* [[Ellipsometer (Woollam)]]
+
=====Topographical Metrology=====
* [[4-Point Probe Resistivity Mapper]]
+
 
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
+
*[[Step Profilometer (KLA Tencor P-7)]]
* [[Deep UV Optical Microscope (Olympus)]]
+
*[[Step Profilometer (Dektak 6M)]]
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
+
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
 +
*[[Surface Analysis (KLA/Tencor Surfscan)]]
 +
**''Sub-micron Particle Counter''
 +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 +
| width="400" |
 +
=====Thin-Film/Material Analysis=====
 +
 
 +
======Thickness + Optical Constants======
 +
 
 +
*[[Ellipsometer (Woollam)]]
 +
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
 +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
 +
*[[Optical Film Thickness (Nanometric)]]
 +
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 +
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
 +
 
 +
======Other Properties======
 +
 
 +
*[[Film Stress (Tencor Flexus)]]
 +
*[[Photoluminescence PL Setup (Custom)]]
 +
 
 +
======Electrical Analysis======
 +
 
 +
*[[Resistivity Mapper (CDE RESMAP)]]
 +
*[[Probe Station & Curve Tracer]]
 +
 
 +
=====Other Tools=====
 +
 
 +
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
 +
**''Surface hydrophobicity''
 +
|-
 +
|
 +
|
 
|-
 
|-
 
|}
 
|}

Latest revision as of 12:50, 4 September 2021

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Other Properties
Electrical Analysis
Other Tools