Difference between revisions of "Tool List"
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=====Photoresists and Lithography Chemicals===== |
=====Photoresists and Lithography Chemicals===== |
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| − | *See the [https:// |
+ | *See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page]. |
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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*[[DUV Flood Expose]] |
*[[DUV Flood Expose]] |
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| − | ===== |
+ | =====Direct-Write Lithography===== |
*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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| + | *[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]] |
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| − | *[[Nano-Imprint (Nanonex NX2000)]] |
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| + | *[[Focused Ion-Beam Lithography (Raith Velion)]] |
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| + | *[[Maskless Aligner (Heidelberg MLA150)]] |
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| + | |||
| + | =====Other Patterning Systems===== |
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| + | |||
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
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| width="400" | |
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*[[Vacuum Oven (YES)]] |
*[[Vacuum Oven (YES)]] |
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| − | ===== |
+ | =====Lithography Support===== |
| − | *The [https:// |
+ | *The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes. |
| − | *POLOS spinners on Develop and Solvent benches |
+ | *[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches |
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]] |
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]] |
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*[[RIE 3 (MRC)]] |
*[[RIE 3 (MRC)]] |
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*[[RIE 5 (PlasmaTherm)]] |
*[[RIE 5 (PlasmaTherm)]] |
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| + | |||
| − | *[[Ashers (Technics PEII)]] |
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| + | =====Plasma Etching and Cleaning===== |
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| + | |||
*[[Plasma Clean (Gasonics 2000)]] |
*[[Plasma Clean (Gasonics 2000)]] |
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*[[Plasma Clean (YES EcoClean)]] |
*[[Plasma Clean (YES EcoClean)]] |
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*[[Plasma Activation (EVG 810)]] |
*[[Plasma Activation (EVG 810)]] |
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| − | *[[ |
+ | *[[Ashers (Technics PEII)]] |
=====Etch Monitoring===== |
=====Etch Monitoring===== |
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*[[ICP Etch 2 (Panasonic E640)]] |
*[[ICP Etch 2 (Panasonic E640)]] |
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*[[ICP-Etch (Unaxis VLR)]] |
*[[ICP-Etch (Unaxis VLR)]] |
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| + | *[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]] |
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*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
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*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
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| + | |||
| + | =====Ion Milling and Reactive Ion Beam Etching===== |
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| + | |||
| + | *[[CAIBE (Oxford Ion Mill)]] |
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=====Other Dry Etching===== |
=====Other Dry Etching===== |
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*[[Spin Rinse Dryer (SemiTool)]] |
*[[Spin Rinse Dryer (SemiTool)]] |
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*[[Chemical-Mechanical Polisher (Logitech)]] |
*[[Chemical-Mechanical Polisher (Logitech)]] |
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| + | *[[Mechanical Polisher (Allied)]] |
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*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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| − | *[https://signupmonkey.ece.ucsb.edu/ |
+ | *[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)] |
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**[[Vacuum Oven (YES)]] |
**[[Vacuum Oven (YES)]] |
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**[[High Temp Oven (Blue M)]] |
**[[High Temp Oven (Blue M)]] |
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| + | | |
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|- valign="top" |
|- valign="top" |
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| width="300" | |
| width="300" | |
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| − | =====Optical |
+ | =====Optical Microscopy===== |
*[[Microscopes|Optical Microscopes]] |
*[[Microscopes|Optical Microscopes]] |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]] |
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]] |
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| + | *[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
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| + | |||
| + | =====Electron Microscopy===== |
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| + | |||
*[[Field Emission SEM 1 (FEI Sirion)]] |
*[[Field Emission SEM 1 (FEI Sirion)]] |
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*[[Field Emission SEM 2 (JEOL 7600F)]] |
*[[Field Emission SEM 2 (JEOL 7600F)]] |
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**''Sub-micron Particle Counter'' |
**''Sub-micron Particle Counter'' |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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| − | *[[Optical Profilometer - White-Light/Phase-Shift Interference (Filmetrics Profilm3D)]] |
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| width="400" | |
| width="400" | |
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| − | =====Thin-Film Analysis |
+ | =====Thin-Film/Material Analysis===== |
| + | |||
| + | ======Thickness + Optical Constants====== |
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*[[Ellipsometer (Woollam)]] |
*[[Ellipsometer (Woollam)]] |
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| ⚫ | |||
| ⚫ | |||
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]] |
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]] |
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| ⚫ | |||
| ⚫ | |||
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
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*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
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| + | |||
| ⚫ | |||
| + | ======Other Properties====== |
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| + | |||
| ⚫ | |||
| ⚫ | |||
| + | |||
| + | ======Electrical Analysis====== |
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| + | |||
*[[Resistivity Mapper (CDE RESMAP)]] |
*[[Resistivity Mapper (CDE RESMAP)]] |
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| ⚫ | |||
=====Other Tools===== |
=====Other Tools===== |
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| + | *[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]] |
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| ⚫ | |||
| + | **''Surface hydrophobicity'' |
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| − | *[[Goniometer]] |
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| + | |- |
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| ⚫ | |||
| + | | |
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| + | | |
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Revision as of 12:50, 4 September 2021
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and Cleaning
Etch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Other PropertiesElectrical AnalysisOther Tools
|