Difference between revisions of "Tool List"
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(→Thermal Processing: linked to new Ovens Overview page, reorganized ovens under this, removed Strip Annealer link (removed from lab)) |
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__NOTOC__ |
__NOTOC__ |
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=Lithography= |
=Lithography= |
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+ | |||
− | You can see our available photoresists on the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemical_Datasheets Chemical Datasheets page]. |
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|- valign="top" |
|- valign="top" |
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| width="300" | |
| width="300" | |
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+ | =====Photoresists and Lithography Chemicals===== |
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− | ===== Contact Aligners (Optical Exposure) ===== |
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+ | |||
− | * [[Suss Aligners (SUSS MJB-3)]] |
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+ | *See the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page]. |
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− | * [[IR Aligner (SUSS MJB-3 IR)]] |
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+ | *[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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− | * [[Contact Aligner (SUSS MA-6)]] |
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+ | |||
− | * [[DUV Flood Expose]] |
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+ | =====Contact Aligners (Optical Exposure)===== |
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+ | |||
+ | *[[Suss Aligners (SUSS MJB-3)]] |
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+ | *[[IR Aligner (SUSS MJB-3 IR)]] |
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+ | *[[Contact Aligner (SUSS MA-6)]] |
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+ | *[[DUV Flood Expose]] |
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+ | |||
+ | =====Direct-Write Lithography===== |
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+ | |||
+ | *[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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+ | *[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]] |
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+ | *[[Focused Ion-Beam Lithography (Raith Velion)]] |
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+ | *[[Maskless Aligner (Heidelberg MLA150)]] |
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===== Other Patterning Systems ===== |
===== Other Patterning Systems ===== |
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+ | *[[Nano-Imprint (Nanonex NX2000)]] |
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− | * [[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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+ | *[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
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− | * [[Nano-Imprint (Nanonex NX2000)]] |
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− | * [[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
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| width="400" | |
| width="400" | |
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− | ===== |
+ | =====Steppers (Optical Exposure)===== |
+ | |||
− | * [[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]] |
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− | * |
+ | *[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]] |
− | * |
+ | *[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]] |
+ | *[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]] |
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+ | |||
+ | =====Thermal Processing for Photolithography===== |
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+ | |||
+ | *[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]] |
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+ | *[[Ovens 1, 2 & 3 (Labline)]] |
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+ | *[[Oven 4 (Fisher)]] |
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+ | *[[Oven 5 (Labline)]] |
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+ | *[[High Temp Oven (Blue M)]] |
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+ | *[[Vacuum Oven (YES)]] |
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+ | |||
+ | =====Lithography Support===== |
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+ | *The [https://wiki.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes. |
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− | ===== Thermal Processing for Photolithography ===== |
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+ | *[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches |
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− | * [[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]] |
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+ | *[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]] |
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− | * [[Ovens 1, 2 & 3 (Labline)]] |
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− | * [[Oven 4 (Fisher)]] |
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− | * [[Oven 5 (Labline)]] |
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− | * [[High Temp Oven (Blue M)]] |
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− | * [[Vacuum Oven (YES)]] |
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− | * The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes. |
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− | = |
+ | =Vacuum Deposition= |
{| |
{| |
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|- valign="top" |
|- valign="top" |
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| width="300" | |
| width="300" | |
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− | ===== |
+ | =====Physical Vapor Deposition (PVD)===== |
− | *[[E-Beam 1 (Sharon)]] |
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− | *[[E-Beam 2 (Custom)]] |
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− | *[[E-Beam 3 (Temescal)]] |
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− | *[[E-Beam 4 (CHA)]] |
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− | *[[Thermal Evap 1]] |
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− | *[[Thermal Evap 2 (Solder)]] |
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+ | *[[E-Beam 1 (Sharon)]] |
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− | ===== Sputter Deposition ===== |
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− | *[[ |
+ | *[[E-Beam 2 (Custom)]] |
− | *[[ |
+ | *[[E-Beam 3 (Temescal)]] |
+ | *[[E-Beam 4 (CHA)]] |
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+ | *[[Thermal Evap 1]] |
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+ | *[[Thermal Evap 2 (Solder)]] |
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+ | |||
+ | =====Sputter Deposition===== |
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+ | |||
+ | *[[Sputter 3 (AJA ATC 2000-F)]] |
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+ | *[[Sputter 4 (AJA ATC 2200-V)]] |
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*[[Sputter 5 (AJA ATC 2200-V)]] |
*[[Sputter 5 (AJA ATC 2200-V)]] |
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*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
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| width="400" | |
| width="400" | |
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− | ===== |
+ | =====Chemical Vapor Deposition (CVD)===== |
+ | |||
− | *[[PECVD 1 (PlasmaTherm 790)]] |
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− | *[[PECVD |
+ | *[[PECVD 1 (PlasmaTherm 790)]] |
− | *[[ |
+ | *[[PECVD 2 (Advanced Vacuum)]] |
− | *[[ |
+ | *[[ICP-PECVD (Unaxis VLR)]] |
+ | *[[Molecular Vapor Deposition]] |
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*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]] |
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]] |
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− | = |
+ | =Dry Etch= |
{| |
{| |
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|- valign="top" |
|- valign="top" |
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| width="300" | |
| width="300" | |
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− | ===== |
+ | =====Reactive Ion Etching (RIE)===== |
− | *[[RIE 2 (MRC)]] |
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− | *[[RIE 3 (MRC)]] |
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− | *[[RIE 5 (PlasmaTherm)]] |
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− | *[[Ashers (Technics PEII)]] |
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− | *[[Plasma Clean (Gasonics 2000)]] |
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− | *[[Plasma Activation (EVG 810)]] |
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− | *[[CAIBE (Oxford Ion Mill)]] |
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+ | *[[RIE 2 (MRC)]] |
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− | ===== Etch Monitoring ===== |
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+ | *[[RIE 3 (MRC)]] |
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− | * [[Laser Etch Monitoring]] (Endpoint Detection) |
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+ | *[[RIE 5 (PlasmaTherm)]] |
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− | * Optical Emission Spectra |
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+ | |||
− | * Residual Gas Analyzer (RGA) |
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+ | =====Plasma Etching and Cleaning===== |
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+ | |||
+ | *[[Plasma Clean (Gasonics 2000)]] |
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+ | *[[Plasma Clean (YES EcoClean)]] |
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+ | *[[Plasma Activation (EVG 810)]] |
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+ | *[[Ashers (Technics PEII)]] |
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+ | |||
+ | =====Etch Monitoring===== |
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+ | |||
+ | *[[Laser Etch Monitoring]] (Endpoint Detection) |
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+ | *Optical Emission Spectra |
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+ | *Residual Gas Analyzer (RGA) |
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| width="400" | |
| width="400" | |
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− | ===== |
+ | =====ICP-RIE===== |
+ | |||
− | *[[ICP Etch 1 (Panasonic E626I)]] |
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− | *[[ICP Etch |
+ | *[[ICP Etch 1 (Panasonic E626I)]] |
+ | *[[ICP Etch 2 (Panasonic E640)]] |
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*[[ICP-Etch (Unaxis VLR)]] |
*[[ICP-Etch (Unaxis VLR)]] |
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*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
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− | *[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
+ | *[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
+ | |||
+ | =====Ion Milling and Reactive Ion Beam Etching===== |
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+ | |||
+ | *[[CAIBE (Oxford Ion Mill)]] |
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+ | |||
+ | =====Other Dry Etching===== |
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+ | *[[UV Ozone Reactor]] |
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− | ===== Other Dry Etching ===== |
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+ | *[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
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− | *[[UV Ozone Reactor]] |
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− | *[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
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*[[Vapor HF Etch]] |
*[[Vapor HF Etch]] |
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|- valign="top" |
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| width="300" | |
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− | * |
+ | *[[Wet Benches]] |
**[[Solvent Cleaning Benches]] |
**[[Solvent Cleaning Benches]] |
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**[[Spin Coat Benches]] |
**[[Spin Coat Benches]] |
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**[[Plating Bench]] |
**[[Plating Bench]] |
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| width="400" | |
| width="400" | |
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− | * |
+ | *[[Gold Plating Bench]] |
− | * |
+ | *[[Critical Point Dryer]] |
− | * |
+ | *[[Spin Rinse Dryer (SemiTool)]] |
− | * |
+ | *[[Chemical-Mechanical Polisher (Logitech)]] |
+ | *[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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+ | *[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)] |
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|- valign="top" |
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| width="400" | |
| width="400" | |
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− | * |
+ | *[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]] |
− | * |
+ | *[[Rapid Thermal Processor (SSI Solaris 150)]] |
− | * |
+ | *[[Tube Furnace (Tystar 8300)]] |
− | * |
+ | *[[Tube Furnace Wafer Bonding (Thermco)]] |
− | * |
+ | *[[Tube Furnace AlGaAs Oxidation (Lindberg)]] |
− | * |
+ | *[[Wafer Bonder (SUSS SB6-8E)]] |
− | * |
+ | *[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
| width="400" | |
| width="400" | |
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− | * |
+ | *[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]] |
− | ** |
+ | **[[Ovens 1, 2 & 3 (Labline)]] |
− | ** |
+ | **[[Oven 4 (Thermo-Fisher HeraTherm)]] |
− | ** |
+ | **[[Oven 5 (Labline)]] |
− | ** |
+ | **[[Vacuum Oven (YES)]] |
− | ** |
+ | **[[High Temp Oven (Blue M)]] |
+ | | |
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=Packaging= |
=Packaging= |
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+ | |||
− | * [[Dicing Saw (ADT)]] |
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− | * |
+ | *[[Dicing Saw (ADT)]] |
+ | *[[Flip-Chip Bonder (Finetech)]] |
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− | * [[Vacuum Sealer]] |
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− | * |
+ | *[[Vacuum Sealer]] |
+ | *[[Wire Saw (Takatori)]] |
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=Inspection, Test and Characterization= |
=Inspection, Test and Characterization= |
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|- valign="top" |
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| width="300" | |
| width="300" | |
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− | ===== |
+ | =====Optical Microscopy===== |
− | * [[Microscopes|Optical Microscopes]] |
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− | * [[Fluorescence Microscope (Olympus MX51)]] |
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− | * [[Deep UV Optical Microscope (Olympus)]] |
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− | * [[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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− | * [[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]] |
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− | * [[Field Emission SEM 1 (FEI Sirion)]] |
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− | * [[Field Emission SEM 2 (JEOL 7600F)]] |
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− | * [[SEM Sample Coater (Hummer)]] |
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+ | *[[Microscopes|Optical Microscopes]] |
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− | ===== Topographical Metrology ===== |
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− | * |
+ | *[[Fluorescence Microscope (Olympus MX51)]] |
+ | *[[Deep UV Optical Microscope (Olympus)]] |
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− | * [[Step Profilometer (Dektak 6M)]] |
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+ | *[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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− | * [[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]] |
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+ | *[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]] |
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− | * [[Surface Analysis (KLA/Tencor Surfscan)]] |
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+ | |||
− | ** ''Sub-micron Particle Counter'' |
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+ | ===== Electron Microscopy ===== |
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− | * [[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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+ | *[[Field Emission SEM 1 (FEI Sirion)]] |
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− | * [[Optical Profilometer - White-Light/Phase-Shift Interference (Filmetrics Profilm3D)]] |
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+ | *[[Field Emission SEM 2 (JEOL 7600F)]] |
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+ | *[[SEM Sample Coater (Hummer)]] |
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+ | |||
+ | =====Topographical Metrology===== |
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+ | |||
+ | *[[Step Profilometer (KLA Tencor P-7)]] |
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+ | *[[Step Profilometer (Dektak 6M)]] |
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+ | *[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]] |
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+ | *[[Surface Analysis (KLA/Tencor Surfscan)]] |
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+ | **''Sub-micron Particle Counter'' |
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+ | *[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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| width="400" | |
| width="400" | |
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− | ===== |
+ | =====Thin-Film/Material Analysis===== |
− | * [[Ellipsometer (Woollam)]] |
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− | * [[Film Stress (Tencor Flexus)]] |
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− | * [[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
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− | * [[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]] |
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− | * [[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
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− | * [[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
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− | * [[Optical Film Thickness (Nanometric)]] |
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− | * [[Resistivity Mapper (CDE RESMAP)]] |
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− | ===== |
+ | ====== Thickness + Optical Constants ====== |
+ | *[[Ellipsometer (Woollam)]] |
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− | * [[Probe Station & Curve Tracer]] |
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+ | *[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]] |
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− | * [[Goniometer]] |
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+ | *[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
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− | * [[Photoluminescence PL Setup (Custom)]] |
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+ | *[[Optical Film Thickness (Nanometric)]] |
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+ | *[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
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+ | *[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
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+ | |||
+ | ====== Other Properties ====== |
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+ | *[[Film Stress (Tencor Flexus)]] |
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+ | *[[Photoluminescence PL Setup (Custom)]] |
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+ | |||
+ | ====== Electrical Analysis ====== |
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+ | *[[Resistivity Mapper (CDE RESMAP)]] |
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+ | *[[Probe Station & Curve Tracer]] |
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+ | |||
+ | =====Other Tools===== |
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+ | |||
+ | *[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]] |
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+ | **''Surface hydrophobicity'' |
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+ | |- |
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+ | | |
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+ | | |
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Revision as of 23:14, 26 January 2021
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and Cleaning
Etch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Other PropertiesElectrical AnalysisOther Tools
|