Difference between revisions of "Tool List"

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__NOTOC__
  
__NOTOC__
 
=Lithography=
  
=Lithography=
  +
−
You can see our available photoresists on the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemical_Datasheets Chemical Datasheets page].
  
 
{|
  
{|
 
|- valign="top"
  
|- valign="top"
 
| width="300" |
  
| width="300" |
  +
=====Photoresists and Lithography Chemicals=====
−
===== Contact Aligners (Optical Exposure) =====
  
  +
−
* [[Suss Aligners (SUSS MJB-3)]]
  
  +
*See the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
−
* [[IR Aligner (SUSS MJB-3 IR)]]
  
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
−
* [[Contact Aligner (SUSS MA-6)]]
  
  +
−
* [[DUV Flood Expose]]
  
  +
=====Contact Aligners (Optical Exposure)=====
  +
  +
*[[Suss Aligners (SUSS MJB-3)]]
  +
*[[IR Aligner (SUSS MJB-3 IR)]]
  +
*[[Contact Aligner (SUSS MA-6)]]
  +
*[[DUV Flood Expose]]
  +
  +
=====Direct-Write Lithography=====
  +
  +
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
  +
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
  +
*[[Focused Ion-Beam Lithography (Raith Velion)]]
  +
*[[Maskless Aligner (Heidelberg MLA150)]]
   
 
===== Other Patterning Systems =====
  
===== Other Patterning Systems =====
  +
*[[Nano-Imprint (Nanonex NX2000)]]
−
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
  
  +
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
−
* [[Nano-Imprint (Nanonex NX2000)]]
  
−
* [[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
  
 
| width="400" |
  
| width="400" |
−
===== Steppers (Optical Exposure) =====
 +
=====Steppers (Optical Exposure)=====
−
* [[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
  
−
* [[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
  
−
* [[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
  
   
  +
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
−
===== Thermal Processing for Photolithography =====
  
  +
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
−
* [[Ovens 1, 2 & 3 (Labline)]]
  
  +
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
−
* [[Oven 4 (Fisher)]]
  
  +
−
* [[Oven 5 (Labline)]]
  
  +
=====Thermal Processing for Photolithography=====
−
* [[High Temp Oven (Blue M)]]
  
  +
−
* [[Vacuum Oven (YES)]]
  
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
−
* The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
  
  +
*[[Ovens 1, 2 & 3 (Labline)]]
  +
*[[Oven 4 (Fisher)]]
  +
*[[Oven 5 (Labline)]]
  +
*[[High Temp Oven (Blue M)]]
  +
*[[Vacuum Oven (YES)]]
  +
  +
=====Lithography Support=====
  +
  +
*The [https://wiki.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
  +
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
  +
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
|-
  
|-
 
|}
  
|}
   
−
= Vacuum Deposition =
 +
=Vacuum Deposition=
   
 
{|
  
{|
 
|- valign="top"
  
|- valign="top"
 
| width="300" |
  
| width="300" |
−
===== Physical Vapor Deposition (PVD) =====
 +
=====Physical Vapor Deposition (PVD)=====
−
*[[E-Beam 1 (Sharon)]]
 
−
*[[E-Beam 2 (Custom)]]
 
−
*[[E-Beam 3 (Temescal)]]
 
−
*[[E-Beam 4 (CHA)]]
 
−
*[[Thermal Evap 1]]
 
−
*[[Thermal Evap 2 (Solder)]]
 
   
  +
*[[E-Beam 1 (Sharon)]]
−
===== Sputter Deposition =====
  
−
*[[Sputter 3 (AJA ATC 2000-F)]]
+
*[[E-Beam 2 (Custom)]]
−
*[[Sputter 4 (AJA ATC 2200-V)]]
+
*[[E-Beam 3 (Temescal)]]
  +
*[[E-Beam 4 (CHA)]]
  +
*[[Thermal Evap 1]]
  +
*[[Thermal Evap 2 (Solder)]]
  +
  +
=====Sputter Deposition=====
  +
  +
*[[Sputter 3 (AJA ATC 2000-F)]]
  +
*[[Sputter 4 (AJA ATC 2200-V)]]
 
*[[Sputter 5 (AJA ATC 2200-V)]]
  
*[[Sputter 5 (AJA ATC 2200-V)]]
 
*[[Ion Beam Deposition (Veeco NEXUS)]]
  
*[[Ion Beam Deposition (Veeco NEXUS)]]
   
 
| width="400" |
  
| width="400" |
−
===== Chemical Vapor Deposition (CVD) =====
 +
=====Chemical Vapor Deposition (CVD)=====
  +
−
*[[PECVD 1 (PlasmaTherm 790)]]
 
−
*[[PECVD 2 (Advanced Vacuum)]]
+
*[[PECVD 1 (PlasmaTherm 790)]]
−
*[[ICP-PECVD (Unaxis VLR)]]
+
*[[PECVD 2 (Advanced Vacuum)]]
−
*[[Molecular Vapor Deposition]]
+
*[[ICP-PECVD (Unaxis VLR)]]
  +
*[[Molecular Vapor Deposition]]
 
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
  
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
   
 
|}
  
|}
   
−
= Dry Etch =
 +
=Dry Etch=
   
 
{|
  
{|
 
|- valign="top"
  
|- valign="top"
−
| width="300" |
+
| width="300" |
  +
=====Reactive Ion Etching (RIE)=====
−
*[[RIE 2 (MRC)]]
 
  +
−
*[[RIE 3 (MRC)]]
 
−
*[[RIE 5 (PlasmaTherm)]]
+
*[[RIE 2 (MRC)]]
−
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
+
*[[RIE 3 (MRC)]]
−
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)]]
+
*[[RIE 5 (PlasmaTherm)]]
  +
−
*[[Ashers (Technics PEII)]]
 
  +
=====Plasma Etching and Cleaning=====
−
*[[UV Ozone Reactor]]
 
  +
−
*[[CAIBE (Oxford Ion Mill)]]
 
  +
*[[Plasma Clean (Gasonics 2000)]]
−
| width="400" |
 
−
*[[ICP Etch 1 (Panasonic E626I)]]
+
*[[Plasma Clean (YES EcoClean)]]
−
*[[ICP Etch 2 (Panasonic E640)]]
+
*[[Plasma Activation (EVG 810)]]
  +
*[[Ashers (Technics PEII)]]
  +
  +
=====Etch Monitoring=====
  +
  +
*[[Laser Etch Monitoring]] (Endpoint Detection)
  +
*Optical Emission Spectra
  +
*Residual Gas Analyzer (RGA)
  +
| width="400" |
  +
=====ICP-RIE=====
  +
  +
*[[ICP Etch 1 (Panasonic E626I)]]
  +
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP-Etch (Unaxis VLR)]]
  
*[[ICP-Etch (Unaxis VLR)]]
  +
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
−
*[[Plasma Clean (Gasonics 2000)]]
 
  +
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
−
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
 
  +
−
*[[Plasma Activation (EVG 810)]]
 
  +
=====Ion Milling and Reactive Ion Beam Etching=====
  +
  +
*[[CAIBE (Oxford Ion Mill)]]
  +
  +
=====Other Dry Etching=====
  +
  +
*[[UV Ozone Reactor]]
  +
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
 
*[[Vapor HF Etch]]
  
*[[Vapor HF Etch]]
   
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|- valign="top"
  
|- valign="top"
 
| width="300" |
  
| width="300" |
−
* [[Wet Benches]]
 +
*[[Wet Benches]]
 
**[[Solvent Cleaning Benches]]
  
**[[Solvent Cleaning Benches]]
 
**[[Spin Coat Benches]]
  
**[[Spin Coat Benches]]
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**[[Plating Bench]]
  
**[[Plating Bench]]
 
| width="400" |
  
| width="400" |
−
* [[Gold Plating Bench]]
 +
*[[Gold Plating Bench]]
−
* [[Critical Point Dryer]]
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*[[Critical Point Dryer]]
−
* [[Spin Rinse Dryer (SemiTool)]]
 +
*[[Spin Rinse Dryer (SemiTool)]]
−
* [[Chemical-Mechanical Polisher (Logitech)]]
 +
*[[Chemical-Mechanical Polisher (Logitech)]]
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  +
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 
|-
  
|-
 
|}
  
|}
   
 
=Thermal Processing=
  
=Thermal Processing=
  +
{|
−
* [[Rapid Thermal Processor (AET RX6)]]
  
  +
|- valign="top"
−
* [[Strip Annealer]]
  
  +
| width="400" |
−
* [[Tube Furnace (Tystar 8300)]]
  
  +
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
−
* [[Tube Furnace Wafer Bonding (Thermco)]]
  
  +
*[[Rapid Thermal Processor (SSI Solaris 150)]]
−
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
  
−
* [[Wafer Bonder (SUSS SB6-8E)]]
 +
*[[Tube Furnace (Tystar 8300)]]
−
* [[Ovens 1, 2 & 3 (Labline)]]
 +
*[[Tube Furnace Wafer Bonding (Thermco)]]
  +
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
−
* [[Oven 4 (Fisher)]]
  
−
* [[Oven 5 (Labline)]]
 +
*[[Wafer Bonder (SUSS SB6-8E)]]
  +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
−
* [[High Temp Oven (Blue M)]]
  
  +
| width="400" |
−
* [[Vacuum Oven (YES)]]
  
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
  +
**[[Ovens 1, 2 & 3 (Labline)]]
  +
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
  +
**[[Oven 5 (Labline)]]
  +
**[[Vacuum Oven (YES)]]
  +
**[[High Temp Oven (Blue M)]]
  +
|
  +
|-
  +
|}
   
 
=Packaging=
  
=Packaging=
  +
−
* [[Dicing Saw (ADT)]]
  
−
* [[Flip-Chip Bonder (Finetech)]]
 +
*[[Dicing Saw (ADT)]]
  +
*[[Flip-Chip Bonder (Finetech)]]
−
* [[Vacuum Sealer]]
  
−
* [[Wire Saw (Takatori)]]
 +
*[[Vacuum Sealer]]
  +
*[[Wire Saw (Takatori)]]
   
 
=Inspection, Test and Characterization=
  
=Inspection, Test and Characterization=
  +
{|
−
{| class="wikitable"
  
 
|- valign="top"
  
|- valign="top"
 
| width="300" |
  
| width="300" |
−
===== Optical/Electron Microscopy =====
 +
=====Optical Microscopy=====
−
* [[Field Emission SEM 1 (FEI Sirion)]]
  
−
* [[Field Emission SEM 2 (JEOL 7600F)]]
  
−
* [[SEM Sample Coater (Hummer)]]
  
−
* [[Microscopes|Optical Microscopes]]
  
−
* [[Fluorescence Microscope (Olympus MX51)]]
  
−
* [[Deep UV Optical Microscope (Olympus)]]
  
−
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  
−
* [[Photo-emission & IR Microscope (QFI)]]
  
   
  +
*[[Microscopes|Optical Microscopes]]
−
===== Topographical Metrology =====
  
−
* [[Step Profile (Dektak IIA)]]
 +
*[[Fluorescence Microscope (Olympus MX51)]]
  +
*[[Deep UV Optical Microscope (Olympus)]]
−
* [[Step Profilometer (Dektak 6M)]]
  
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
−
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
  
  +
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
−
* [[Surface Analysis (KLA/Tencor Surfscan)]]
  
  +
−
** ''Sub-micron Particle Counter''
  
  +
===== Electron Microscopy =====
−
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  
  +
*[[Field Emission SEM 1 (FEI Sirion)]]
  +
*[[Field Emission SEM 2 (JEOL 7600F)]]
  +
*[[SEM Sample Coater (Hummer)]]
  +
  +
=====Topographical Metrology=====
  +
  +
*[[Step Profilometer (KLA Tencor P-7)]]
  +
*[[Step Profilometer (Dektak 6M)]]
  +
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
  +
*[[Surface Analysis (KLA/Tencor Surfscan)]]
  +
**''Sub-micron Particle Counter''
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
| width="400" |
  
| width="400" |
−
===== Thin-Film Analysis/Measurement =====
 +
=====Thin-Film/Material Analysis=====
−
* [[Ellipsometer (Woollam)]]
 
−
* [[Ellipsometer (Rudolph)]]
 
−
* [[Film Stress (Tencor Flexus)]]
 
−
* Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)
  
−
* [[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
  
−
* [[Optical Film Thickness (Nanometric)]]
  
−
* [[Resistivity Mapper (CDE RESMAP)]]
  
   
−
===== Other Tools =====
 +
====== Thickness + Optical Constants ======
  +
*[[Ellipsometer (Woollam)]]
−
* [[Probe Station & Curve Tracer]]
  
  +
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
−
* [[Goniometer]]
  
  +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
  +
*[[Optical Film Thickness (Nanometric)]]
  +
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
  +
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  +
  +
====== Other Properties ======
  +
*[[Film Stress (Tencor Flexus)]]
  +
*[[Photoluminescence PL Setup (Custom)]]
  +
  +
====== Electrical Analysis ======
  +
*[[Resistivity Mapper (CDE RESMAP)]]
  +
*[[Probe Station & Curve Tracer]]
  +
  +
=====Other Tools=====
  +
  +
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
  +
**''Surface hydrophobicity''
  +
|-
  +
|
  +
|
 
|-
  
|-
 
|}
  
|}

Revision as of 23:14, 26 January 2021

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Other Properties
Electrical Analysis
Other Tools
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Tool_List&oldid=158716"