Difference between revisions of "Tool List"

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(Other Patterning Systems: Link to Maskless Aligner (Heidelberg MLA150))
(Lithography: added "direct write" section)
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*[[DUV Flood Expose]]
 
*[[DUV Flood Expose]]
   
=====Other Patterning Systems=====
+
=====Direct-Write Lithography=====
   
 
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
 
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
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*[[Focused Ion-Beam Lithography (Raith Velion)]]
 
*[[Focused Ion-Beam Lithography (Raith Velion)]]
 
*[[Maskless Aligner (Heidelberg MLA150)]]
 
*[[Maskless Aligner (Heidelberg MLA150)]]
  +
  +
===== Other Patterning Systems =====
 
*[[Nano-Imprint (Nanonex NX2000)]]
 
*[[Nano-Imprint (Nanonex NX2000)]]
 
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]

Revision as of 09:26, 5 November 2020

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Other Properties
Electrical Analysis
Other Tools