Difference between revisions of "Tool List"
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(→Lithography: added FEI Sirion Nabity) |
(→Lithography: added "direct write" section) |
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*[[DUV Flood Expose]] |
*[[DUV Flood Expose]] |
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− | ===== |
+ | =====Direct-Write Lithography===== |
*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]] |
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]] |
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+ | *[[Focused Ion-Beam Lithography (Raith Velion)]] |
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+ | *[[Maskless Aligner (Heidelberg MLA150)]] |
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+ | |||
+ | ===== Other Patterning Systems ===== |
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*[[Nano-Imprint (Nanonex NX2000)]] |
*[[Nano-Imprint (Nanonex NX2000)]] |
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*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
Revision as of 10:26, 5 November 2020
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
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Vacuum Deposition
Physical Vapor Deposition (PVD)
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and Cleaning
Etch Monitoring
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ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Other PropertiesElectrical AnalysisOther Tools
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