Difference between revisions of "Tool List"

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__NOTOC__
  
__NOTOC__
 
=Lithography=
  
=Lithography=
  +
{|
  +
|-valign="top"
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|width=200|
 
* [[Suss Aligners]]
  
* [[Suss Aligners]]
 
* [[IR Aligner]]
  
* [[IR Aligner]]
 
* [[DUV Flood Expose]]
  
* [[DUV Flood Expose]]
 
* [[Ovens]]
  
* [[Ovens]]
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|width=200|
 
* [[Stepper 1]]
  
* [[Stepper 1]]
 
* [[Stepper 2]]
  
* [[Stepper 2]]
 
* [[Stepper 3]]
  
* [[Stepper 3]]
 
* [[E-Beam Lithography System]]
  
* [[E-Beam Lithography System]]
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|-
  +
|}
   
 
=Vacuum Deposition=
  
=Vacuum Deposition=
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{|
  +
|-valign="top"
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|width=200|
 
* [[E-Beam 1]]
  
* [[E-Beam 1]]
 
* [[E-Beam 2]]
  
* [[E-Beam 2]]
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* [[Sputter 3]]
  
* [[Sputter 3]]
 
* [[Sputter 4]]
  
* [[Sputter 4]]
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|width=200|
 
* [[Sputter 5]]
  
* [[Sputter 5]]
 
* [[PECVD 1]]
  
* [[PECVD 1]]
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* [[Molecular Vapor Deposition]]
  
* [[Molecular Vapor Deposition]]
 
* [[Atomic Layer Deposision]]
  
* [[Atomic Layer Deposision]]
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|-
−  
  +
|}
 
=Dry Etch=
  
=Dry Etch=
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{|
  +
|-valign="top"
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|width=200|
 
* [[RIE 1]]
  
* [[RIE 1]]
 
* [[RIE 2]]
  
* [[RIE 2]]
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* [[Ashers]]
  
* [[Ashers]]
 
* [[VLR Etch]]
  
* [[VLR Etch]]
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|width=200|
 
* [[ICP Etch 1]]
  
* [[ICP Etch 1]]
 
* [[ICP Etch 2]]
  
* [[ICP Etch 2]]
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* [[XeF2 Etch]]
  
* [[XeF2 Etch]]
 
* [[Plasma Activation Tool]]
  
* [[Plasma Activation Tool]]
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|-
  +
|}
   
 
=Wet Processing=
  
=Wet Processing=

Revision as of 15:09, 27 June 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization

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