Difference between revisions of "Tool List"
Jump to navigation
Jump to search
| Line 2: | Line 2: | ||
=Lithography= |
=Lithography= |
||
{| |
{| |
||
| − | |-valign="top" |
+ | |-valign="top" |
|width=300| |
|width=300| |
||
* [[Suss Aligners (SUSS MJB-3)]] |
* [[Suss Aligners (SUSS MJB-3)]] |
||
* [[IR Aligner (SUSS MJB-3 IR)]] |
* [[IR Aligner (SUSS MJB-3 IR)]] |
||
| − | * [[DUV Flood |
+ | * [[DUV Flood Expsaad3 (Labline)]] |
| − | * [[Ovens 1, 2 & 3 (Labline)]] |
||
* [[Oven 4 (Fisher)]] |
* [[Oven 4 (Fisher)]] |
||
* [[High Temp Oven (Blue M)]] |
* [[High Temp Oven (Blue M)]] |
||
Revision as of 15:48, 16 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Dicing Saw (ADT)
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Wafer Bonder (SUSS SB6-8E)
- Wire Saw (Takatori)