Thermal Oxidation of Silicon

Online calculators for thermal oxidation can be used to estimate the oxidation time for a desired oxidation thickness.

Please see Calculators + Utilities page for links to these oxidation calculators.

Thermal oxidation recipes for Wet (H2O vapor) and Dry (O2 gas) oxidation up to 1050°C are available on the TyStar 8300 system.

Wafer Substrate Bonding

Numerous research groups perform wafer bonding using either the Suss Wafer Bonder or a custom graphite fixture and any one of numerous ovens, such as the N2-purged Wafer Bonding Furnace (with glove box) or N2-purged Blue M oven.

The EVG Plasma Activation system and Goniometer allow for surface prep/inspection prior to bonding.