Difference between revisions of "Thermal Evap 2 (Solder)"

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Line 323: Line 323:
 
|6.47
 
|6.47
 
|1.18
 
|1.18
 +
|
 +
|
 +
|-
 +
|Silver chloride
 +
|AgCl
 +
|5.56
 +
|1.32
 +
|
 +
|
 +
|-
 +
|Sodium
 +
|Na
 +
|0.97
 +
|4.8
 +
|
 +
|
 +
|-
 +
|Sodium chloride
 +
|NaCl
 +
|2.17
 +
|1.57
 +
|
 +
|
 +
|-
 +
|Tantalum
 +
|Ta
 +
|16.6
 +
|0.262
 +
|
 +
|
 +
|-
 +
|Tantalum(IV) oxide
 +
|Ta<sub>2</sub>O<sub>5</sub>
 +
|8.2
 +
|0.30
 
|
 
|
 
|
 
|
 
|-
 
|-

Revision as of 08:10, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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Materials Table