Difference between revisions of "Thermal Evap 2 (Solder)"

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|1.98
 
|1.98
 
|2.05
 
|2.05
 +
|
 +
|
 +
|-
 +
|Selenium
 +
|Se
 +
|4.82
 +
|0.864
 +
|
 +
|
 +
|-
 +
|Silicon
 +
|Si
 +
|2.32
 +
|0.712
 +
|
 +
|
 +
|-
 +
|Silicon(II) Oxide
 +
|SiO
 +
|2.13
 +
|0.87
 +
|
 +
|
 +
|-
 +
|Silicon dioxide (fused quarz)
 +
|SiO2
 +
|2.20
 +
|1.07
 
|
 
|
 
|
 
|
 
|-
 
|-

Revision as of 08:01, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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